CLUSTERLINE® Family

Benefit from the CLUSTERLINE® reputation of secure handling and precision processing on a range of platform sizes up to 650mm in applications across all Evatec core markets. 

Evatec CLUSTERLINE® 200 & PEALD

Check out the partnership between CLUSTERLINE® 200 and Evatec PEALD! See in our new video how PEALD technology brings better conformality, precise thickness control, and repeatability at a great cost.

FOPLP - GET THE BROCHURE

CLUSTERLINE® 200 BPM – Dynamic Sputter System

From Micro LED to Edge Emitting Lasers and RF filters, CLUSTERLINE® 200 BPM gives you gold medal winning performance in thin film deposition

SilTerra selects Evatec

SilTerra deploys Evatec’s CLUSTERLINE^® 200 for manufacturing high performance Piezo-MEMS devices.

Evatec & Disco Hi-Tec

Evatec and Disco Hi-Tec announce a partnership based around development of processes on Evatec’s CLUSTERLINE® 300 II.

SkyWater chooses Evatec

SkyWater has chosen CLUSTERLINE® 300 equipped with high performance evaporation technology for new process developments.

LAYERS 8 – CLUSTERLINE® 600 & next generation IC-substrates

LAYERS 8 – PEALD: The new kid on the CLUSTERLINE® block

Read more about Evatecs new module for Plasma-Enhanced Atomic Layer Deposition (PEALD) in Layers 8.

LAYERS 8 – Quantized Nanolaminates through the microscope

Find out about the the potential benefits for optical thin film production and why Evatec’s CLUSTERLINE® 200 BPM dynamic sputter tool is well suited to nanolaminates deposition.

LAYERS 8 – Power ICs: New Cu Frontside processes on 300mm

Learn why Evatec’s CLUSTERLINE® 300 is the ideal platform to satisfy the growing demand for 300mm processing and how Evatec process know-how is delivering high performance thick copper layers.

Evatec LAYERS 8 SAP Power Frontsideprocess SP

SMART Center "fast-tracks" piezoelectrics

The Northeastern University SMART Center has added an Evatec CLUSTERLINE^® 200  to its nanofabrication capability

LAYERS 5 - LOW LOSS CMOS

Compatible silicon nitride photonics utilizing reactive sputtered thin films on CLUSTERLINE® 200

Evatec Clusterline600 16Pp Ed2 Dec2021 WEB

Hot ITO

PECVD Technology

Learn about Evatec PECVD processes using PLASMABOX® technology and how they deliver optimum film quality by ensuring uniform heat distribution and very low levels of cross-contamination. 

Skyater 2019

"MADMAX" - the search for dark matter

Evatec’s CLUSTERLINE is supporting the search for dark matter in the European MADMAX project

LAYERS 7 – Low temperature PVD deposition of low stress SiN and SiCN films for Hybrid Bonding applications

Intel’s and Evatec’s experts investigate the feasibility of high quality low stress SiN and SiCN film deposition on Evatec’s CLUSTERLINE®.

Evatec LAYERS 8 CP Photonics Metalenses SP

THE SKY’S THE LIMIT WITH CLUSTERLINE® 300

Kai Wenz, Senior Manager Development Projects for BU Semiconductor at Evatec, reveals the thinking behind the release of a new high performance front-end sputtering module on the latest variant of CLUSTERLINE® 300.

Enabling next generation FOPLP

Fraunhofer IZM and Evatec co-operate on next generation FO-PLP and IC-Substrate processing

LAYERS 5 - ITO DEP & ETCH ENABLING OLED ON CMOS

Evatec Product Marketing Manager Franz Xaver Lenherr tells us how leveraging 30 years of know-how in sputtering and etch helped us fast track development of ITO deposition and ITO etch processes on CLUSTERLINE® 300 to produce the anode for next generation OLED on CMOS on 300mm.

We are nominated - please vote for Evatec

Please cast your vote now at the 2021 3D InCites awards recognizing industry-wide contributions in the development of heterogeneous integration technologies.

Evatec LAYERS7 SE Power Devices

Evatec LAYERS 8 CEO SP

Evatec LAYERS 8 Corporate PEALD SP

Evatec LAYERS 8 Corporate Sam SP

Evatec LAYERS7 SE Front End Integration

CLUSTERLINE® 300

From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the deposition of soft magnetics for integrated voltage regulators on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.

CLUSTERLINE® 600

Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.

LED or LASER

LAYERS 5 - SOFT MAGNETICS READY FOR THE FUTURE!

Evatec’s Senior Product Marketing Manager, Maurus Tschirky tells us how taking a proven concept, leveraging other existing know-how and a bit of simple thinking is the risk free way to develop a high performance new module on CLUSTERLINE® 300 for production of integrated voltage regulators on 300mm in quick time.

Evatec LAYERS 8 CP Optoelectronics Sidewall SP

Evatec LAYERS 8 SAP Clusterline600 SP

Semi Wireless BAW

SilTerra

CLUSTERLINE 200 BPM_Dec2021

CLUSTERLINE® 200

From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.

LAYERS 5 - Plasma assisted SiO2 FOR TC-SAW DEVICES

Evatec’s Process Engineer Hokwon Kim, Scientist Edmund Schuengel and Product Marketing Manager Carlo Tosi explain the importance of temperature compensation for TC-SAW devices and how plasma enhanced reactive magnetron sputter deposition on CLUSTERLINE® provides a cost effective manufacturing solution.

Evatec LAYERS 8 SAP Power HEXAGON D6 SP

Silicon Austria Labs enhances thin film technology with new PEALD module

Silicon Austria Labs (SAL) and Evatec collaborate to enhance thin film technology capabilities with the addition of a PEALD module at SAL’s Villach facility.

LAYERS 5 -Ultra-thin flexible HDI-PCBs

Overcoming challenges in fabrication using CLUSTERLINE® panel-sized etch and sputter solutions

PVD Technologies

Find out how Evatec's evaporation and sputter technology know-how can help you increase your yields and drive down your costs.

STRESS IMPROVEMENT FOR FBARS

HOT SPUTTERED ITO - A NEW PROCESS FOR LED

Semi MEMS Soft Magnetics

POWER_BACKSIDE_LAYERS6

Evatec LAYERS 8 SAP Crosscontamination SP

Power Devices

Benefit from Evatec's long experience in Power Device applications to increase your productivity, process stability and yield in volume production of MOSFETs, IGBTs, IGCTs, LDMOS, SiC and GaN Power Devices.

MEMS

Evatec supports production solutions for the metals, dielectrics and Advanced Functional Materials (Magnetics and Piezoelectrics) used in Sensors, Actuators, TFH and Quantum Computing. 

VCSEL_LAYERS6

OE Micro LED

FBAR

Evatec LAYERS7 PH EEL

Evatec wins SJ Semi award

Evatec Advanced Packaging group wins supplier award at SJ SEMICONDUCTOR CORPORATION.

Quantum Computing gets a research boost

The German government just announced 19 million Euros of state funding to develop insights from research in the field of quantum technologies with regard to practical applications and to harness their potential for industry. 

Etch Technologies

From modification of sensitive coatings to high rate layer removal, read more about Evatec plasma source technology covering applications at wafer or panel level. 

LAYERS 8 – Side Wall coverage – Maximizing performance in devices

Find out in LAYERS 8 why device side wall coverage is becoming important for thin film processes in Optoelectronic applications.

LAYERS 7 – SiC – Powering ahead in Power Devices

Evatec’s experts remind us why Wide Band Gap (WBG) materials like SiC have an exciting role to play in emerging power device applications.

LAYERS 5 - POWER DEVICE MANUFACTURING

Evatec’s Product Marketing Managers Hans Auer and Gernot Engstler give us an overview on the state of play in front and backside metallization processes and production solutions on CLUSTERLINE®

LAYERS 8 – HEXAGON – double up in power device applications

Find out how Evatec’s HEXAGON could double your throughput in selected power device applications.

SAL_ September 2021

Evatec LAYERS 8 CP Wireless BAW 6G SP

OIC Poster A Walder 47X47 V4

MICRO_LED_LAYERS6

Evatec LAYERS7 PH Augmented Reality

Semi PD_PowerDevices

Semi Power Devices

Precision Optics

Evatec thin film technology supports the economical manufacture of highly accurate optical components ensuring optimal performance in systems that rely on precise light manipulation.

Evatec LAYERS7 SE BAW Hot Chuck

Functional Coatings

Elevate your product performance with Evatec high-end Functional Coatings solutions, - high perfomance and high volume at the lowest cost of ownership.

LAYERS 5 - FAST TRACKING PROCESS DEVELOPMENT

An enhanced lab environment equipped with enhanced thin film characterization and measurement tools is the perfect way to help our customers speed up their new process development.

LAYERS 5 - EVATEC YOUR PARTNER IN MICRO LED

The layer types may be the same, but the demands are different for the new emerging micro LED technology when compared with conventional LED production. Stefan Seifried, Head of Business Unit Optoelectronics summarizes the current state of play.

LAYERS 8 – Navigating innovation: A conversation with our CTO

Our CTO, Dr. Carlo Tosi, shares insights into the innovation process at Evatec, how we help our customers, and why he's excited for the future. 

LAYERS 8 – Cross-Contamination in Multi-Chamber PVD Systems

Find out in the study of Fraunhofer and Evatec why HEXAGON PVD systems are ideal for modern WLP applications.

LAYERS 6 - 300MM BACKSIDE METALLIZATION PROCESSES

Latest high demands on productivity and performance require tailoring of process configurations depending on the individual application needs of customers. Find out how Evatec can offer improved process control and productivity  

Road to 2 billion

Panel Level Packaging

Production proven thin film solutions for Panel-Level packaging applications, on panel-sized substrates up to 650x650mm.  

Wafer Level Optics (WLO)

WLO uses semiconductor techniques to mass-produce mini optical components. Evatec enables cost-efficient production for use as standalone parts or on pre-processed dies.

AP HDI PCB

Evatec LAYERS 8 SAP PCB SP (1)

241112 Press Release PEALD

Wireless

Evatec pioneers PVD solutions for metals, contacts, piezoelectrics, and dielectrics—powering RF filters, amplifiers, GaN HEMTs, and IR devices. Our high-volume systems define wireless performance standards.

AlScN

OE ITO Dep Etch

AP Fan Out

Semi Wireless TC SAW

Evatec LAYERS7 AP PVD Low Stress

Evatec LAYERS 8 CP Optoelectronics Hybriddbr SP

Frontend

Learn more about Evatec solutions supporting the demand for higher device performance driven by Moore’s law and “More than Moore” approaches.

Evatec LAYERS7 Global Web 3

APC Technologies

See how Evatec's Advanced Process Control (APC) Technologies can help you increase precision and production yield for thin film processes. 

PEALD Technology

With innovative features like a microwave plasma source and in-situ post-treatment capabilities, users enjoy precise deposition of thin dielectric films at low temperatures.

BIOMETRICS_LAYERS6

Evatec LAYERS 8 CP Photonics Nanolaminates SP

Evatec LAYERS7 USA Web 4

Evatec Collaborates with Onto Innovation in Panel Level Packaging Applications Center of Excellence

Read more about Evatec’s collaboration with Onto Innovation in the newly opened Packaging Applications Center of Excellence (PACE) here.

MSP Brochure

ECL Fast Track

Layers 5 Corporate Eclfasttrack (1)

SUPPORT_LAYERS6

Evatec LAYERS7 TOWARDS PERFECTION WITH HEXAGON

LAYERS 6- SEMICONDUCTOR CHAPTER

LAYERS 6 - SEMICONDUCTOR

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Wafer Level Packaging

Discover Evatec's Thin Film Solutions for Wafer-Level Packaging: Bumping (UBM), Fan-Out Wafer-Level Packaging (FO-WLP), and Back-Side Metal (BSM) Applications 

Evatec LAYERS7 OP Insights

LED OR LASER - EVATEC HAS THE SOLUTION

Evatec LAYERS7 SE Shanghaitech

CLUSTERLINE® 200 II IS READY

Evatec LAYERS 8 SAP Power Frontsidecopper SP

Discrete LED / Laser

Explore how Evatec’s proven portfolio of platforms and processes in daily production at the world’s leading O-LED, Mini-LED, Micro-LED, VCSEL and EEL manufacturers increase performance and drive down costs per lumen.  

PHO Low Loss CMOS

PHO Optical Monitoring

Layers 5 Photonics Opticalmonitoring (1)

LAYERS 6 - PACKAGING

Helping Customers Grow

RFID

AlScN epitaxy

Company Overview

Our technology has been shaping the world for over 70 years. Find out more about our company, our products and how Evatec thin films are everywhere in our daily lives. 

Evatec LAYERS7 OP ITO

Evatec LAYERS 8 Corporate CTO SP

Evatec LAYERS 8 SAP Power Gan SP

Magnetron Sputter Deposition Of Amorphous Silicon Sio2 Quantized Nanolaminates