PVD TECHNOLOGIES

Advanced Evaporation and Sputter Technologies

Benefit from Evatec's long experience in PVD technology with high performance evaporation and sputter sources. Evaporation technology and process know-how is available across the industry standard BAK Family and on selected cluster tools for custom applications. From single or co sputter to both magnetron and enhanced magnetron technologies,

our sputter knowhow is available across different source formats to support applications across Advanced Packaging, Semiconductor, Optoelectronics and Photonics. 

To learn more click on the individual tabs or click here to contact us.  

Evaporation 

Evatec’s know-how in evaporation source and process technology culminates from over 50 years experience starting with the original Balzers BAK electron beam evaporation platforms. In addition to our latest generation digital electron beam gun technology we offer a wide range of additional specialist thermal sources such as barrel sources and effusion cells on our modern BAK platforms built for manual or completely automated loading in a range of standard or extended throw configurations.  

Superior thin film properties are achieved by ion beam densification or combined plasma polymerization processes. Sophisticated monitoring techniques including quartz or optical monitoring ensure high precision and reliability.

Click here to view the typical BAK capacity chart  To read more about the BAK family click here 

Magnetron Sputter

Evatec has developed a wide variety of proprietary Magnetron Sputter technology, each tailored for specific thin film requirements and optimized for the different machine types:

  • DC, for metal sputtering
  • DC Pulsed, for reactive as well as for energy-controlled sputtering
  • DC High Current Pulsed, for ionized sputtering
  • RF, for sputtering of dielectrics
  • DC+RF, for energy-controlled sputtering

Linear planar magnetrons are used in batch rotating drum machines (such as our LLS EVO and  MSP platforms). Besides their simplicity of design, a long target life and the availability of a wide range of target materials these magnetrons are capable to provide material mixing on the atomic scale. In rotating drum machines, it is also possible to deposit films with anisotropic properties, as it is requested for example in magnetic devices.

Round planar magnetrons are used in machines with:

All these round planar magnetrons, ranging from 80 to 500mm in target diameter, apply rotating magnets in order to provide full face erosion and an optimized target utilization. The rotating magnets are typically designed for the smallest possible target diameter, so that the highest possible material transfer factor and the lowest possible CoO is guaranteed. At the same time different patented magnet adjustment techniques are applied to achieve the best uniformity. These techniques allow to tune the uniformity over the entire target life, even for very thick targets up to 25mm.

Rotatable cylindrical magnetrons are used for static sputtering of large substrates (e.g CLUSTERLINE® 600), where an extremely long target life can be achieved.

Depending on the application Evatec’s sputtering stations are equipped with Advanced Process Control techniques for measuring the film thickness by optical monitoring, in-situ temperature as well as film stress in real time.

PVD PLATFORMS

We offer a range of batch, cluster or fully automated inline platforms incorporating PVD source technology.

Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.

BAK  FAMILY

Family of evaporators from 0.5 to 2.0 metres for manual or assisted loading offering electron beam evaporation and thermal source technologies.

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CLUSTERLINE® 200

Fully automated 200mm cluster platform equipped with single or batch  process modules enabling sputter, etch and PECVD technologies.

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CLUSTERLINE® 300

Fully automated 300mm cluster platform equipped with single or batch  process modules (for soft magnetics) offering sputter and etch technologies.

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CLUSTERLINE® 600  

Tool for FOPLP and next generation IC substrate sizes up to 650x650mm integrating large area degas, etch and sputter technologies

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HEXAGON  

Dedicated platform for advanced packaging applications like FOWLP offering custom degas, etch and sputter technologies on 300mm.

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LLS EVO

Vertical batch sputter platform with a proven track record in the semiconductor industry available for manual or robot load.

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MSP  

High throughput batch sputter solution for production of high precision optical coatings handling substrate sizes up to 560 x 380mm. 

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SOLARIS® FAMILY

High speed inline sputter solutions for selected volume applications in advanced packaging, semiconductor, and photonics.

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Benefit from Evatec's long experience in PVD technology with high performance evaporation and sputter sources. Evaporation technology and process know-how is available across the industry standard BAK Family and on selected cluster tools for custom applications. From single or co sputter to both magnetron and enhanced magnetron technologies,

our sputter knowhow is available across different source formats to support applications across Advanced Packaging, Semiconductor, Optoelectronics and Photonics. 

To learn more click on the individual tabs or click here to contact us.  

Evaporation 

Evatec’s know-how in evaporation source and process technology culminates from over 50 years experience starting with the original Balzers BAK electron beam evaporation platforms. In addition to our latest generation digital electron beam gun technology we offer a wide range of additional specialist thermal sources such as barrel sources and effusion cells on our modern BAK platforms built for manual or completely automated loading in a range of standard or extended throw configurations.  

Superior thin film properties are achieved by ion beam densification or combined plasma polymerization processes. Sophisticated monitoring techniques including quartz or optical monitoring ensure high precision and reliability.

Click here to view the typical BAK capacity chart  To read more about the BAK family click here 

Magnetron Sputter

Evatec has developed a wide variety of proprietary Magnetron Sputter technology, each tailored for specific thin film requirements and optimized for the different machine types:

  • DC, for metal sputtering
  • DC Pulsed, for reactive as well as for energy-controlled sputtering
  • DC High Current Pulsed, for ionized sputtering
  • RF, for sputtering of dielectrics
  • DC+RF, for energy-controlled sputtering

Linear planar magnetrons are used in batch rotating drum machines (such as our LLS EVO and  MSP platforms). Besides their simplicity of design, a long target life and the availability of a wide range of target materials these magnetrons are capable to provide material mixing on the atomic scale. In rotating drum machines, it is also possible to deposit films with anisotropic properties, as it is requested for example in magnetic devices.

Round planar magnetrons are used in machines with:

All these round planar magnetrons, ranging from 80 to 500mm in target diameter, apply rotating magnets in order to provide full face erosion and an optimized target utilization. The rotating magnets are typically designed for the smallest possible target diameter, so that the highest possible material transfer factor and the lowest possible CoO is guaranteed. At the same time different patented magnet adjustment techniques are applied to achieve the best uniformity. These techniques allow to tune the uniformity over the entire target life, even for very thick targets up to 25mm.

Rotatable cylindrical magnetrons are used for static sputtering of large substrates (e.g CLUSTERLINE® 600), where an extremely long target life can be achieved.

Depending on the application Evatec’s sputtering stations are equipped with Advanced Process Control techniques for measuring the film thickness by optical monitoring, in-situ temperature as well as film stress in real time.

PVD PLATFORMS

We offer a range of batch, cluster or fully automated inline platforms incorporating PVD source technology.

Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.

LATEST NEWS - SPUTTER & EVAPORATION