CLUSTERLINE®
Cluster architecture 200mm, 300mm and 600mm formats
CLUSTERLINE® FAMILY
CLUSTERLINE® are a family of platforms named according to their substrate size capability. All platforms share cluster architecture with cassette-to-cassette processing and fully automated handling. Production solutions on CLUSTERLINE® cross all 6 Evatec core markets.
Whatever your application, our specialists can help you configure an ideal CLUSTERLINE® platform for you. We deliver complete process solutions including highly aligned magnetic films, high performance piezoelectrics like AlScN for broadband RF filters and highly efficient energy harvesting devices, high aspect ratio TSV metallization in Advanced Packaging or precise deposition of TCOs and multilayer dielectrics for the latest micro LED and 3D filter technologies.
Welcome to 310x310 processing
Evatec is leveraging its know-how in both 300mm wafer processing and large panel processing to deliver a dedicated platform for panel processing up to 310mm.
CLUSTERLINE® 200
From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.
CLUSTERLINE® 300
From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the depoistion of soft magnetics for integrated voltage regulations on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.
CLUSTERLINE® 600
Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.
CLUSTERLINE® Family Brochure
CLUSTERLINE® Family Video
Read more about the CLUSTERLINE® Family in our LAYERS magazine
Innovations & Opportunities in Panel Level Packaging
Evatec is driving the next wave of Panel Level Packaging, from 310x310 mm to 650x650 mm panels, unlocking higher bandwidth and cost efficiency for AI chiplets.
Welcome to Advanced Directional Sputtering (ADS)
PEALD: The new kid on the CLUSTERLINE® block
Buying a new Evatec tool is just the first step in a long term partnership. From initial ramp up support to ongoing maintenance or retrofits adding new capabilities, maximise both uptime and tool working life together with Evatec’s local customer service teams.
- We can help you plan and manage your stocks
- Use our exchange programmes to minimize downtimes
- Our local Field Service Engineers on hand when you need us
- Maximizing output - From Continuous Improvement Programmes (CIP) to new process installations
- Add new capabilities to support your technology roadmaps
- Helping you extend tool working life
- Helping you to help yourself
- Tailored just for you - At Evatec or in your own fab