CLUSTERLINE® are a family of platforms named according to their substrate size capability. All platforms share cluster architecture with cassette-to-cassette processing and fully automated handling. Production solutions on CLUSTERLINE® cross all 6 Evatec core markets.
Whatever your application, our specialists can help you configure an ideal CLUSTERLINE® platform for you. We deliver complete process solutions including highly aligned magnetic films, high performance piezoelectrics like AlScN for broadband RF filters and highly efficient energy harvesting devices, high aspect ratio TSV metallization in Advanced Packaging or precise deposition of TCOs and multilayer dielectrics for the latest micro LED and 3D filter technologies.
From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.
From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the deposition of soft magnetics for integrated voltage regulators on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.
Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.