LLS EVO II

Vertical sputter for metals, dielectrics and magnetic films

The LLS EVO II is a versatile batch sputtering system with a vertical, dynamic concept for up to 5 different materials and separation between load and process chamber (LC, PC). It accommodates any substrate size and shape up to 200 x 230mm. An installed base of over 300 tools worldwide has shown the tool to be reliable and robust production platform. Its flexibility, compact design and lower investment costs make it an ideal choice for smaller volume production alongside the larger single substrate processing tools in Evatec's product portfolio.

The tool can be equipped with configurable power supplies for high process flexibility. Substrate degas and etch in load chamber ensure high purity processes in the process chamber while easy conversion to various substrate sizes within 5 minutes make the LLS a flexible production tool.

To download the LLS EVO II brochure click here. 

Do you already have an LLS?  

Then why not upgrade its capabilities to the latest standards?

  • Learn about oval target technology that reduces your material costs and particles, or choose from Evatec alignment technology options for the deposition of aligned magnetic films.
  • Find out about our high energy cathode technology and tailored magnet systems for increased deposition rates.
  • Read about control system and other component modernization options to replace obsolete parts, improve uptime and extend system life.
  • Our engineering team is ready to support you with custom engineering services like tooling design and manufacture.


To download the LLS Retrofit brochure click here

 

 

LLS EVO II features 

  • Up to 5 sputter sources with DC, DC pulsed, RF, RF/DC combined setup
  • Co-sputtering from up to 3 cathodes
  • Reactive sputtering with oxygen and nitrogen
  • High vacuum system configurations with turbo pump, cryo pump and water trap
  • Substrate heater for degas and increased process temperature
  • Accommodation of any substrate type with size up to 200 x 230mm, or thickness up to 17mm
  • Substrate tooling for full face deposition or customized edge exclusion, edge masking, shadow masking
  • Automated cassette-to-cassette 6-axis robot handling as an option.

 

Benefit from Evatec's long process experience delivering the LLS EVO II and previous generations across all standard materials used in the semiconductor and optoelectronics industries including:

  • Production of aligned soft magnetic films
  • Low damage film nucleation processes
  • Reactive sputtering processes

To read more about typical application examples download the LLS EVO II brochure or visit the news section of our web site.

 

The LLS EVO II is a versatile batch sputtering system with a vertical, dynamic concept for up to 5 different materials and separation between load and process chamber (LC, PC). It accommodates any substrate size and shape up to 200 x 230mm. An installed base of over 300 tools worldwide has shown the tool to be reliable and robust production platform. Its flexibility, compact design and lower investment costs make it an ideal choice for smaller volume production alongside the larger single substrate processing tools in Evatec's product portfolio.

The tool can be equipped with configurable power supplies for high process flexibility. Substrate degas and etch in load chamber ensure high purity processes in the process chamber while easy conversion to various substrate sizes within 5 minutes make the LLS a flexible production tool.

To download the LLS EVO II brochure click here. 

Do you already have an LLS?  

Then why not upgrade its capabilities to the latest standards?

  • Learn about oval target technology that reduces your material costs and particles, or choose from Evatec alignment technology options for the deposition of aligned magnetic films.
  • Find out about our high energy cathode technology and tailored magnet systems for increased deposition rates.
  • Read about control system and other component modernization options to replace obsolete parts, improve uptime and extend system life.
  • Our engineering team is ready to support you with custom engineering services like tooling design and manufacture.


To download the LLS Retrofit brochure click here

 

 

LLS EVO II features 

  • Up to 5 sputter sources with DC, DC pulsed, RF, RF/DC combined setup
  • Co-sputtering from up to 3 cathodes
  • Reactive sputtering with oxygen and nitrogen
  • High vacuum system configurations with turbo pump, cryo pump and water trap
  • Substrate heater for degas and increased process temperature
  • Accommodation of any substrate type with size up to 200 x 230mm, or thickness up to 17mm
  • Substrate tooling for full face deposition or customized edge exclusion, edge masking, shadow masking
  • Automated cassette-to-cassette 6-axis robot handling as an option.

 

Benefit from Evatec's long process experience delivering the LLS EVO II and previous generations across all standard materials used in the semiconductor and optoelectronics industries including:

  • Production of aligned soft magnetic films
  • Low damage film nucleation processes
  • Reactive sputtering processes

To read more about typical application examples download the LLS EVO II brochure or visit the news section of our web site.