LLS EVO II
Vertical sputter for metals, dielectrics and magnetic films
Flexible, compact vertical batch sputter tool for metals, dielectrics and soft magnetics on substrates up to 230mm
Flexible Design
- Up to 5 sputter sources including co deposition
- Simple exchange between different substrate sizes
Extensive Evatec process know-how
- Degas, etch and deposition
- From metals and dielectrics to TCOs & soft magnetics
Production proven
- More than 300 tools around the world
- Customized solutions including front end automation
LLS EVO II
The LLS EVO II is a versatile batch sputtering system based on vertical, dynamic concept and separation between load and process chamber (LC, PC). It can be equipped with up to five sputter cathodes and one etching source and is designed to process wafers with diameters of up to 300 mm. An installed base of over 300 tools worldwide has shown the tool to be reliable and robust production platform. Its compact design and lower investment costs make it an ideal choice for smaller volume production alongside the larger single substrate processing tools in Evatec's product portfolio.
The tool can be equipped with configurable power supplies for high process flexibility. Substrate degas and etch capabilities in the load chamber ensure high purity processes in the process chamber, while easy conversion to various substrate sizes within 5 minutes make the LLS one of the most flexible production tools in the market for mid volume, mixed production requirements.
From high rate metals and co deposited alloy stacks, to world leading laminated soft magnetic multilayers using integrated insitu magnetic filed alignment technology benefit from Evatec deposition process know on LLS for complete production solutions across semiconductor markets including MEMS and Optoelectronics
Major system components – a quick guide
Click on the individual sections in the circle for a quick overview, and then find more information further down the page.
Basic Platform
Vertical load lock configuration with dynamic sputter from up to 5 target locations in main chamber
- Manual front side loading as standard
- integration of additional degas, heating or etch capability within the load lock chamber
- integration of optional robot loading
Integrated cryo-, turbo- and forepumps ensure stable high-vacuum conditions and rapid recovery times.
Etch
Choose from RF or ion beam etch capabilities integrated within the load lock chamber
Sputter
Install up to 5 vertical cathodes in DC, RF, mixed DC/RF or Pulsed DC mode.
- Parallel operation ( co sputter) for up to 3 sources enables higher rates and allows mixtures or continuous phasing of different materials.
Heating
Instal heating for effective substrate temperature management within either the load lock or process chamber
Substrate cage
LLS EVO II and its rotary cage carrier concept is designed to give you the ultimate in flexibility
- Manual loading for complete or mixed batches of substrate sizes of 2,3,4,5,6, and 8 inch.
- Change configuration of substrate sizes in just a few minutes
- Batch processing of substrates up to maximum size of 200x230mm
Auxiliary equipment
Integrated media supply and rack designs keep the LLS footprint to a minimum whilst system design and accessories like the integrated cage lift device facilitate maintenance
Automation
Integrate optional 6 axis robot solution with cassette buffer, flat/notch aligner and bar code reader
Basic platform
Vertical load lock configuration. Dynamic sputter from up to 5 sputter target locations in main chamber with integration of additional optional degas, heating or etch capability within the load lock chamber. Integrated Meissner options within the load lock or main chambers, combined with forepumps and turbo or cryogenic pumping options for main chamber ensure stable, repeatable high-vacuum conditions and rapid recovery times.
Manual front side loading comes as standard with optional integration of robot loading for increased automation.
Etch
Choose from RF or ion beam etch capabilities integrated within the load lock chamber.
Sputter
Whether you choose full face deposition, shadow masking or customised edge exclusion, LLS loading and rotary cage concept can be configured for either manual load or fully automatic cassette-to-cassette handling. Install up to 5 vertical cathodes in DC, RF, mixed DC/RF or Pulsed DC mode. Parallel operation (co sputter) for up to 3 sources enables higher rates and allows mixtures or continuous phasing of different materials.
Ask us about the following source options:
- New oval cathode technology for reduced materials cost and even lower particle counts
- “High Energy Cathode” technology for improved throughput in high rate metallization processes (Al & Al alloys)
- High performance magnet systems for extended life in sputter of both magnetic and non magnetic materials
Heating
Install heating for effective substrate temperature management within either the load lock or process chamber.
Substrate Cage
LLS EVO II and its rotary cage carrier concept is designed to give you the ultimate in flexibility.
- Manual loading for complete or mixed batches of substrate sizes of 2,3,4,5,6, and 8 inch
- Change configuration of substrate sizes in just a few minutes
- Batch processing of substrates up to maximum size of 200x230mm
Different cage variants are also available in combination with handling robots for wafer "front" and "backside" processes incorporating additional features such as cooling. Our engineers are ready to support you with customised solutions.
Auxiliary Equipment
Whilst system design includes integrated media supplies, rack designs and integrated cage lift devices keep the LLS footprint to a minimum or facilitate maintenance in daily life, Evatec supports other features supporting daily production including:
- Wafer ID and Barcode readers
- Residual Gas Analysers
Automation
Integrate optional 6-axis robot solutions with cassette buffer, flat/notch aligner and bar code reader
- Dedicated solutions for either "front" or "backside" wafer processes
Process Know-How
Benefit from Evatec's long process experience delivering the LLS EVO II and previous generations across all standard materials used in the semiconductor and optoelectronics industries including:
- Production of aligned soft magnetic films
- Low damage film nucleation processes
- Reactive sputtering processes
Do you already have an LLS?
Then why not upgrade its capabilities to the latest standards?
- Learn about oval target technology that reduces your material costs and particles, or choose from Evatec alignment technology options for the deposition of aligned magnetic films.
- Find out about our high energy cathode technology and tailored magnet systems for increased deposition rates.
- Read about control system and other component modernization options to replace obsolete parts, improve uptime and extend system life.
- Our engineering team is ready to support you with custom engineering services like tooling design and manufacture.
Read more about LLS EVO II in our LAYERS magazine
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Buying a new Evatec tool is just the first step in a long term partnership. From initial ramp up support to ongoing maintenance or retrofits adding new capabilities, maximise both uptime and tool working life together with Evatec’s local customer service teams.
- We can help you plan and manage your stocks
- Use our exchange programmes to minimize downtimes
- Our local Field Service Engineers on hand when you need us
- Maximizing output - From Continuous Improvement Programmes (CIP) to new process installations
- Add new capabilities to support your technology roadmaps
- Helping you extend tool working life
- Helping you to help yourself
- Tailored just for you - At Evatec or in your own fab