31st July 2020

LAYERS 5 -Ultra-thin flexible HDI-PCBs

Process and application teams from Evatec and GS Swiss PCB collaborated over the past two years. Evatec’s Senior Scientist, Mohamed Elghazzali and Dr. Rodica Ababei from GS Swiss PCB explain how they developed a robust manufacturing solution for sputtered seed layers on ultra-thin substrates. The main focus was on maximizing the adhesion for the deposited titanium/copper seed layer in combination with the subsequent electroplating processes, all under the very demanding process reliability requirements from GS Swiss PCB and their customers.

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