1st December 2020

Enabling next generation FOPLP

Evatec AG and Fraunhofer IZM are co-operating in the field of advanced organic IC Substrates and fan-out Panel Level Packaging. Focus is on advanced thin film etching technology for panel sizes up to 650x650mm.  New equipment has been installed at Fraunhofer's facility in Berlin.  To read more about Evatec's CLUSTERLINE® 600 and its capabilities visit our product pages 

To view the Fraunhofer press release for more details of the co-operation  CLICK HERE