CLUSTERLINE® 600

Panel processing up to 650mm

 

A large area cluster tool for single panel processing, Evatec's panel tool was introduced in 2017, and is already production proven for substrates up to 550x550mm. The latest version now offers capability for substrate sizes up to 650 x 650mm. It integrates degas, etch and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced IC substrate manufacturing.

Choose CLUSTERLINE® 600 for:

  • Flexible cluster architecture
  • Processing of glass or highly outgassing substrates
  • Substrate static during processes for lowest particle counts
  • Degas, etch and deposition process know-how  

The CLUSTERLINE® 600 open system architecture is based around a 6 sided vacuum transport module with vacuum load lock allowing easy tool configuration and future expansion for panel sizes up to 650 x 650mm.

An atmospheric frontend integrating atmospheric robot and aligner enables integration of up to four load port modules.

Panel control options include warpage detection, ionizer, electrostatic sensors, RF ID and panel temperature sensors.

CLUSTERLINE® 600 Platform

  • 6 sided vacuum transport module with vacuum load lock
  • Up to 5 process modules for etch or sputter processes
  • Innovative new high performance Interface Transfer Module (ITM). Two load locks on one VTM flange

 

CLUSTERLINE® 600 Process Modules / Components

  • Full process isolation
  • Atmospheric Batch Degasser(s)
  • Arctic etch technology for highly outgassing substrates
  • Highly uniform etch and sputter technologies
  • No moving panels during processing for best cooling and particle performance

 

 

It all starts with atmospheric degas technology. Simultaneous degassing of 21 substrates at atmospheric pressure offers superior performance over vacuum processes with uniform degas for the best film adhesion after subsequent processing.

Dual frequency, dual electrode CCP etch source technology offers high uniformity large area etch while the panel is static for the best particle performnance. RIE etch technology is also available according to customer process requirements.

Rotary cathode sputter technology offers low cost of ownership. Just like in etch, panels remain static during sputter processing for lowest particle counts. 

For more information about our customers are successfully using the tool for FOPLP production take a look at the story from our technology magazine LAYERS or contact your local sales & service organization.

 

A large area cluster tool for single panel processing, Evatec's panel tool was introduced in 2017, and is already production proven for substrates up to 550x550mm. The latest version now offers capability for substrate sizes up to 650 x 650mm. It integrates degas, etch and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced IC substrate manufacturing.

Choose CLUSTERLINE® 600 for:

  • Flexible cluster architecture
  • Processing of glass or highly outgassing substrates
  • Substrate static during processes for lowest particle counts
  • Degas, etch and deposition process know-how  

The CLUSTERLINE® 600 open system architecture is based around a 6 sided vacuum transport module with vacuum load lock allowing easy tool configuration and future expansion for panel sizes up to 650 x 650mm.

An atmospheric frontend integrating atmospheric robot and aligner enables integration of up to four load port modules.

Panel control options include warpage detection, ionizer, electrostatic sensors, RF ID and panel temperature sensors.

CLUSTERLINE® 600 Platform

  • 6 sided vacuum transport module with vacuum load lock
  • Up to 5 process modules for etch or sputter processes
  • Innovative new high performance Interface Transfer Module (ITM). Two load locks on one VTM flange

 

CLUSTERLINE® 600 Process Modules / Components

  • Full process isolation
  • Atmospheric Batch Degasser(s)
  • Arctic etch technology for highly outgassing substrates
  • Highly uniform etch and sputter technologies
  • No moving panels during processing for best cooling and particle performance

 

 

It all starts with atmospheric degas technology. Simultaneous degassing of 21 substrates at atmospheric pressure offers superior performance over vacuum processes with uniform degas for the best film adhesion after subsequent processing.

Dual frequency, dual electrode CCP etch source technology offers high uniformity large area etch while the panel is static for the best particle performnance. RIE etch technology is also available according to customer process requirements.

Rotary cathode sputter technology offers low cost of ownership. Just like in etch, panels remain static during sputter processing for lowest particle counts. 

For more information about our customers are successfully using the tool for FOPLP production take a look at the story from our technology magazine LAYERS or contact your local sales & service organization.

 

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