Equipment Front End Module (EFEM)

Front end handling allows integration of up to three (3) load ports for FOUPs with their own controlled mini environments. Evatec EFEM hardware supports SEMI E84 communication, and integration of aligner, buffer, flipper and ID reader capabilities.

An Atmospheric Batch Degasser can also be connected to the EFEM as the first process step in applications like FOWLP.

A high speed airlock is then the interface for substrate transfer between atmospheric and vacuum environments. Fast pump-down and vent cycles are key for enabling the subsequent high speed substrate transfer around etch and deposition process stations. 

Atmospheric Batch Degasser (ABD) 

Atmospheric pressure degassing under hot dry nitrogen laminar flow ensures precise substrate temperatures, enables efficient volatiles transport and avoids cross-contamination seen with traditional vacuum degas processes. Evatec proprietary ABD technology offers the most reproducible, efficient degas technology for high volume manufacturing in FOWLP.

• Performing efficiently relatively low-temperature 
• Suitable for organic or molded wafers
• With optional 28-slot or 44-slot cassette configurations

Indexer Technology

Parallel carrier transfer by synchronous indexer is the perfect solution for achieving the highest transfer speeds around the tool between dedicated process positions for wafer cooling, etch and PVD. Indexer technology is the basis for achieving the lowest cost of ownership in mass production on HEXAGON, supporting 200 or 300mm formats, and handling thin, heavy or bowed substrates at throughputs of up to 100 wafer per hour according to application and process specs. 

Etch 

Evatec enhanced etch technology including capability for "arctic etch" delivers high uniformity, repeatable etch processes providing pre-cleaning and surface activation. Achieve etch uniformities <2 % and benefit from both "In-situ pasting" to reduce wafer pasting frequency and from long kit lifetime of more than 20,000 wafers for high uptime mass production processes.

Sputter

70-years of how-how in PVD processes delivers deposition of Cu and Ti stacks at high power using ARQ310 DC or pulsed DC sputter source with uniformity compensation over target life to achieve outstanding uniformity and process repeatability. 

Optimised shield design facilitates low particle levels in daily production. Long life targets deliver reduced material costs per wafer whilst high deposition rates and fast wafer transfer processes come together to drive down cost of ownership in daily production.

Substrate Chucks

Evatec substrate chuck know-how is used in combination with Evatec process technology options to optimise management of substrate temperature and film uniformity during deposition across different wafer sizes and materials. Evatec Advanced Packaging process specialist have access to multiple configurable "arctic", water-cooled, and rotating water‑cooled chuck technologies according to your process needs.

Auxiliary Components

• Tool Pedestal - Available with solid or perforated designs, the pedestal is the raised floor giving easy access to the tool. It houses and routes media, and is designed to enable easy service accessibility for all elements of the tool 
• Vacuum Pumps - cryo, turbo, fore, and diaphragm pumps are integrated to maximise process stability and located for easy accessibility for maintenance
• Media - Closed-loop thermal control system delivers high cooling efficiency, reduces water and power consumption
• Human Machine Interface - Touch-screen control station runs XPERIENCE software, provides process visualization and data logging, supports SEMI host connectivity
• Racks - Electrical and service racks for system infrastructure contain main power distribution and safety systems

Process Know-How

Proven process capabilities come as standard when you choose HEXAGON.

To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure, view Evatec's LAYERS magazine or visit the news section of our web site.