HEXAGON

Your advantage in Advanced Packaging

HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering high speed degas, etch and metal deposition.

  • Processing of highly outgassing organic passivated wafers
  • Atmospheric frontend handling with a high performance dual end effector SCARA robot for the shortest wafer swap times
  • Parallel wafer transfer by synchronous indexer enables high speed wafer processing
  • Shield kit lifetimes of > 10000 wafers with enhanced uptime and reduced maintenance
  • Footprint less than 10 square metre
  • Strict process chamber and wafer temperature control for repeatable high performance deposition processes.

It's all about throughput

Parallel wafer transfer by synchronous indexer enables high speed wafer processing. Wafer carriers enable full face etch or deposition processes with in chamber wafer sensing for accurate, repeatable positioning time after time in 24/7 production. Reducing maintenance time is at the heart of HEXAGON’s design with simple carrier designs and powered source handling for rapid, easy access by a single operator.

  • Install up to five process modules for degas, etch, cool or dep
  • Bridge capability with simple configuration for either 200mm or 300mm
  • Footprint of <10m2 (not including Service Area) for reduced clean room usage and costs

 

Process Modules

  • Dedicated degasser options for all WLP processes (chuck-, high pressure- and batch- degasser)
  • ICP soft etch module- SiO2 removal 0,6 – 0,8 nm/s
  • Chilled ICP reactor dome down to -30°C
  • ARQ310 DC or pulsed DC sputter source with uniformity compensation over target life
  • Arctic Cooling Module for active process temperature control
  • Chuck RF Bias with auto matching option
  • Controlled chuck temperature from -30 to 300°C
  • Metal or ceramic chuck with mechanical clamping, ESC or clampless chuck with shadow mask
  • Clamped chuck configuration with gas conduction back side heater/cooler for precise temperature control
  • Drop-in shield kits for rapid exchange

Proven process capabilities come as standard when you choose HEXAGON 

To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure or visit the news section of our web site.

 

HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering high speed degas, etch and metal deposition.

  • Processing of highly outgassing organic passivated wafers
  • Atmospheric frontend handling with a high performance dual end effector SCARA robot for the shortest wafer swap times
  • Parallel wafer transfer by synchronous indexer enables high speed wafer processing
  • Shield kit lifetimes of > 10000 wafers with enhanced uptime and reduced maintenance
  • Footprint less than 10 square metre
  • Strict process chamber and wafer temperature control for repeatable high performance deposition processes.

It's all about throughput

Parallel wafer transfer by synchronous indexer enables high speed wafer processing. Wafer carriers enable full face etch or deposition processes with in chamber wafer sensing for accurate, repeatable positioning time after time in 24/7 production. Reducing maintenance time is at the heart of HEXAGON’s design with simple carrier designs and powered source handling for rapid, easy access by a single operator.

  • Install up to five process modules for degas, etch, cool or dep
  • Bridge capability with simple configuration for either 200mm or 300mm
  • Footprint of <10m2 (not including Service Area) for reduced clean room usage and costs

 

Process Modules

  • Dedicated degasser options for all WLP processes (chuck-, high pressure- and batch- degasser)
  • ICP soft etch module- SiO2 removal 0,6 – 0,8 nm/s
  • Chilled ICP reactor dome down to -30°C
  • ARQ310 DC or pulsed DC sputter source with uniformity compensation over target life
  • Arctic Cooling Module for active process temperature control
  • Chuck RF Bias with auto matching option
  • Controlled chuck temperature from -30 to 300°C
  • Metal or ceramic chuck with mechanical clamping, ESC or clampless chuck with shadow mask
  • Clamped chuck configuration with gas conduction back side heater/cooler for precise temperature control
  • Drop-in shield kits for rapid exchange

Proven process capabilities come as standard when you choose HEXAGON 

To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure or visit the news section of our web site.