New Video: Welcome to a world without compromises with CLUSTERLINE® 200

Discover how CLUSTERLINE® 200 combines flexible architecture, multiple process technologies, and proven manufacturing performance to support innovation from R&D through to high-volume production.

LAYERS 9 – Evatec LED Know How for an Exciting EV Future

Evatec’s LED process know‑how supports the next generation of electric vehicles, enabling smaller devices, higher performance, and cost‑efficient mass production. Read more in LAYERS 9.

LAYERS 9 – Innovations and Opportunities in Panel Level Packaging

Panel Level Packaging is gaining momentum as AI and high‑performance computing drive demand for larger substrates and higher integration density. Evatec outlines its technology roadmap for scalable panel based production. Read more in LAYERS 9.

LAYERS 9 – Polarization Control for Next Generation Wireless RF Filters

Periodic polarization control of AlScN piezoelectric layers marks a major step toward high frequency RF filters for future wireless communication systems, including 6G. Read more in LAYERS 9.

LAYERS 9 – Going Big in Japan

Evatec is strengthening its presence in Japan by expanding its local organization and combining global thin film expertise with customer focused support tailored to the Japanese market. Read more in LAYERS 9.

LAYERS 9 – Superconducting thin films for Quantum Computing

Superconducting thin films are a foundation of today’s leading quantum computing approaches. Evatec shows how PVD deposition technologies support the transition from laboratory research to scalable quantum hardware. Read more in LAYERS 9.

LAYERS 9 – SOLARIS® increases throughput for thick aluminum layers

SOLARIS® demonstrates how fully automated cassette to cassette processing can significantly increase throughput for thick aluminum layers in power device manufacturing while maintaining tight temperature control. Read more in LAYERS 9.

LAYERS 9 – From handover to high performance

Evatec’s Ramp‑Up Support helps customers move efficiently from tool installation to stable production by providing on‑site expertise exactly when it matters most. Read more in LAYERS 9.

LAYERS 9 – PZT a long history and an exciting future

PVD deposition of PZT has been a cornerstone of MEMS manufacturing for many years. Evatec outlines how flexible platform concepts now support both high volume production and development needs. Read more in LAYERS 9.

LAYERS 9 – Powering the SiC Future in China

As SiC power devices move toward higher volumes and more complex architectures, Evatec’s CLUSTERLINE® platforms provide flexible, high‑performance metallization solutions for reliable SiC manufacturing. Read more in LAYERS 9.

LAYERS 9 – Welcome to Advanced Directional Sputtering (ADS)

Evatec’s new ADS technology brings advanced directional sputtering to high‑aspect‑ratio and 3D device structures, enabling superior coverage and reliable metallization for next‑generation semiconductor applications. Read more in LAYERS 9.

LAYERS 9 – Optical Monitoring

Evatec’s new GSM 1102 with NIR extension expands in‑situ monitoring up to 1700 nm, offering greater precision and stability for demanding optical thin‑film applications. Read more in LAYERS 9.

LAYERS 9 – Advancing Contact Resistance Control in High Density Packaging

Evatec and Fraunhofer IZM‑ASSID present a newly developed Kelvin resistor test vehicle enabling highly sensitive and accurate measurement of contact resistance in miniature vias for next‑generation wafer‑level packaging.

LAYERS 9 – Flying the High Performance Ferro & Piezoelectrics Flag in the USA

Across North America, universities are leveraging Evatec’s CLUSTERLINE® 200 and MSQ Multi Source platforms to drive breakthroughs in AlN and AlScN materials for next generation MEMS, acoustic, and wireless technologies. Read more in LAYERS 9.

LAYERS 9 – A New Chapter in Operations

Evatec’s new COO, Stefan Marxer, shares his perspective on operational excellence, current challenges, and the initiatives driving faster, more transparent, and more efficient operations.

LAYERS 9 – It’s all about Particle Control

Shrinking Micro LED device sizes demand ever‑tighter particle control. Evatec’s CLUSTERLINE® 200 BPM shows how advanced process engineering supports high‑yield mass production. Read more in LAYERS 9.

C2MI partners with Evatec to expand thin film process capabilities across MEMS & Advanced Packaging

LAYERS 9 – 300mm Frontend Integration

The semiconductor industry is rapidly moving toward smaller features and higher integration density. Evatec’s latest 300mm frontend solutions deliver the advanced sputtering performance needed to support these next‑generation device architectures. Read more in LAYERS 9.

LAYERS 9 – Quantized Nanolaminates

Quantized nanolaminates are redefining what’s possible in optical thin‑film production, offering enhanced stability, improved performance, and new opportunities for scalable manufacturing. Read more in LAYERS 9.

LAYERS 9 - Advancing PEALD with Evatec’s New ECR Plasma Source

Evatec’s latest PEALD developments using a novel Microwave ECR plasma source deliver ultra‑pure Al₂O₃ and highly crystalline AlN films at low temperatures, ideal for advanced logic, memory, MEMS, RF and power applications. Learn more in LAYERS 9.

LAYERS 9 – The Rise of PiezoMEMS

Yole Group’s latest analysis reveals how PiezoMEMS are expanding far beyond RF filters into fast‑growing markets such as microspeakers, oscillators, optical switches and microcooling. Read more in LAYERS 9.

LAYERS 9 – Advancing SiC Power Device Manufacturing

Evatec introduces a breakthrough in silicon carbide (SiC) power device processing through advanced PVD amorphous‑carbon (a‑C) sputtering, delivering cleaner production, superior surface protection, and new opportunities for next‑generation device design. Read more in LAYERS 9.

LAYERS 9 – Strategy in Action

Evatec presents an inside look at its strategy process and how it enables long term innovation, market agility and technology leadership across functional materials and advanced 3D integration. Read more in LAYERS 9.

New Video: Our new dedicated small panel packaging solution is here

Evatec’s new dedicated CLUSTERLINE® 310 packaging solution for smaller panel sizes up to 310x310 is joining its bigger CLUSTERLINE® 600 brother. Find out more in the video.

LAYERS 9 – Photonic integration in the AI era

AI clusters and hyperscale data centers are driving rapid innovation in photonic integrated circuits, with material platforms such as SOI, LNOI and InP shaping the future of high‑speed optical interconnects. Read more in LAYERS 9.

LAYERS 9 – Welcome to small panel processing

LAYERS 9 – Keeping Cool with the Hottest Technology

Evatec’s new hot chuck and cathode innovations enable crystalline growth with PVD for advanced materials. Read more in LAYERS 9.

LAYERS 9 – RF Filters in 2025

Yole Group’s latest analysis shows how BAW and SAW filters shape 5G and Wi Fi 6E/7 performance. Read more in LAYERS 9.

LAYERS 9 – A Message from Andy Wälti

In a world of constant change, Evatec stays true to one principle: building strong partnerships and staying close to customers. Read more in LAYERS 9.

LAYERS 9 is Out Now: Explore the Future of Thin Film Technology

Thin film technology is evolving faster than ever. From AI-driven innovations in Advanced Packaging to new nanolaminate technology in Photonics, LAYERS 9 brings you insights into the hardware and processes shaping tomorrow’s devices.

Evatec Launches Sustainability Page

Following the release of our 2024 Sustainability Report, Evatec has launched a new sustainability web page too. It shows our values and the actions we are taking to protect the climate, reduce the use of resources by ourselves and our customers, and ensure ethical sustainable business practices across our business.

Evatec publishes first Sustainability Report

Technology with Responsibility

Evatec is publishing its first sustainability report. It documents how we embed ecological and social responsibility in our company.  At its core is reporting, which is transparent, measurable, and forward-looking.

New video: CLUSTERLINE® 600 – From Factory to Fab in 90 Seconds

Follow the journey of Evatec’s largest tool from Switzerland to Japan – disassembled, shipped, and installed with precision. A 90-second look at global teamwork in action.

Evatec Achieves Validation for Near-Term Science-Based Emissions Reduction Target

Celebrating Excellence at Silex's 10th Anniversary Dinner

On May 14th, we had the honor of attending the 10th anniversary dinner of our customer Silex. Their event was a celebration of a decade of innovation and success. During the dinner, we were recognized with an award as “excellent supplier” highlighting the strong, collaborative relationship we have built with Silex over the years, our commitment to quality and our dedication to supporting their success.

Evatec opens Shenzhen office

Get to know about Evatec's new office in Shenzhen, China.

LAYERS 8 – HEXAGON – double up in power device applications

Find out how Evatec’s HEXAGON could double your throughput in selected power device applications.

ECL – Supporting customers with thin film coating & characterization services

Read more about the capabilities at Evatec’s Competence Laboratory including thin film characterization techniques in our LAYERS 8 magazine.

LAYERS 8 – Quantized Nanolaminates through the microscope

Find out about the the potential benefits for optical thin film production and why Evatec’s CLUSTERLINE® 200 BPM dynamic sputter tool is well suited to nanolaminates deposition.

LAYERS 8 – Our market organization is ready to serve you!

Learn more about our product-focused organization and Evatec’s business fields in LAYERS 8.

LAYERS 8 – HEXAGON – Optimum Rc Control & Productivity

Read in LAYERS 8 about the latest advancements in high-throughput UBM/RDL technology and the importance of low and stable contact resistance (Rc).

Evatec is committed to sustainability!

We are pleased to announce the submission of our emissions reduction targets to the Science Based Targets Initiative (SBTi). Find out more about our sustainability journey here.

LAYERS 8 – Investigating GaN sputter from a liquid Ga target

Read in LAYERS 8 about the work being done on sputtering from a liquid Ga-target.

Discover our new career page

Our brand-new career page is live! Explore exciting opportunities and learn more about what makes Evatec a great place to work. 

LAYERS 8 – Seamless machine relocation services for your Evatec equipment

Moving thin film equipment can be daunting. Find out how Evatec offers a comprehensive relocation service to minimize downtime and ensure a smooth transition, with insights and real-life examples.

SAL collaboration on PEALD technology brings next generation Radio Frequency Front End (RFFE) components one step closer

Silicon Austria Labs (SAL) is announcing a collaboration with leading supplier Qualcomm Technologies, Inc., through their subsidiary RF360 Europe GmbH, and thin film technology partner Evatec Europe on development of PEALD and PVD technology for the manufacture of next generation RFFE components.

Evatec CLUSTERLINE® 200 & PEALD

Check out the partnership between CLUSTERLINE® 200 and Evatec PEALD! See in our new video how PEALD technology brings better conformality, precise thickness control, and repeatability at a great cost.

Silicon Austria Labs enhances thin film technology with new PEALD module

Silicon Austria Labs (SAL) and Evatec collaborate to enhance thin film technology capabilities with the addition of a PEALD module at SAL’s Villach facility.

Evatec Collaborates with Onto Innovation in Panel Level Packaging Applications Center of Excellence

Read more about Evatec’s collaboration with Onto Innovation in the newly opened Packaging Applications Center of Excellence (PACE) here.

Evatec Partners with Silicon Austria Labs (SAL) for Innovative MEMS microspeakers

We are excited to announce a strategic collaboration with Silicon Austria Labs (SAL) and other industry partners. This joint effort aims to develop cutting-edge solutions for MEMS-based microspeakers.

New BAK Family brochure available

Read about the latest generation of BAK evaporators in our BAK Family brochure.

CLUSTERLINE® 200 BPM – Dynamic Sputter System

From Micro LED to Edge Emitting Lasers and RF filters, CLUSTERLINE® 200 BPM gives you gold medal winning performance in thin film deposition

LAYERS 7- Towards perfection with the new HEXAGON

The new HEXAGON maintains the existing strengths of proven and reliable processes, high throughput and then offers significant improvements and innovations in the areas of process capabilities, throughput, uptime, accessibility and serviceability.

Evatec expands ISO accreditation

Evatec has just completed the reaccreditation process for both ISO 9001 and ISO 14001 until 2026. We are also proud to have gained ISO 45001 accreditation.

BAK 911 - a step up in output

Easier loading, better vacuum conditions and even higher repeatability – what’s not to like! Find out more.

XPERIENCE SOFTWARE - Your Evatec tool on your desktop

XPERIENCE Simulator – Bring your Evatec tool to your desktop.  Using our XPERIENCE  simulator train your personnel, develop  and test process recipes  and familiarise yourself with new software updates before you work with them live.

"MADMAX" - the search for dark matter

Evatec’s CLUSTERLINE is supporting the search for dark matter in the European MADMAX project

THE MULTI BAK - LET THE REVOLUTION BEGIN

The MULTI BAK - Up to 4 process modules with all the load lock and handling you need for fully automated production.  Access the video now to find out more.

THE NEW HEXAGON IS HERE

The new HEXAGON is here.  Our new HEXAGON is the perfect choice for FOWLP, delivering the lowest Rc values at the best cost of ownership.

WHY OPTICAL MONITORING - THE NEW GSM

Optical monitoring technology is the perfect way to improve accuracy and process yields for production of high precision optical layers. Find out more

ON SITE SUPPORT - HERE TO HELP

Having Evatec technicians to support you at your site is a great way to maintain and improve overall system performance and uptime. Find out more

COMING SOON - THE NEW HEXAGON

“Tuning” Perpendicular Magnetic Anisotropy

Find out how Facing Target Sputter technology delivers magnetic multilayers with optimum Perpendicular Magnetic Anisotropy without the need for post deposition anneal

BAK 941- MAKING THE GREAT EVEN BETTER

Silicon Austria Labs pushes boundaries in PZT

Silicon Austria Labs ( SAL)  and Evatec push the boundaries in Lead Zirconium Titanate (PZT) technology.  Find out more. 

Panel Level Packaging Consortium - The first Year

Despite the COVID-19 crisis Fraunhofer IZM and the 17 partners of the PLC 2.0 consortium including Evatec have achieved excellent results within the first year.  Click here to find out more about what they have been doing. 

TOOL RELOCATION - AT YOUR SERVICE

Need to move an existing Evatec tool ? Find out how we can help you relocate your Evatec tools in the most efficient way possible. 

HEALTH CHECK - FIND OUT HOW WE CAN HELP

Learn more about our health check services for your existing Evatec tool

Enabling next generation FOPLP

Fraunhofer IZM and Evatec co-operate on next generation FO-PLP and IC-Substrate processing

SMART Center "fast-tracks" piezoelectrics

The Northeastern University SMART Center has added an Evatec CLUSTERLINE^® 200  to its nanofabrication capability

Evatec wins the Prix SVC Ostschweiz Award

Evatec is the winner of the Prix SVC Ostschweiz award

FOPLP - GET THE BROCHURE

SilTerra selects Evatec

SilTerra deploys Evatec’s CLUSTERLINE^® 200 for manufacturing high performance Piezo-MEMS devices.

Evatec wins SJ Semi award

Evatec Advanced Packaging group wins supplier award at SJ SEMICONDUCTOR CORPORATION.

SILICON NITRIDE PHOTONICS

Prix SVC Finalist News

Evatec is one of the 6 finalist for the Prix SVC (Swiss Venture Club) entrepreneur award.

Evatec & Disco Hi-Tec

Evatec and Disco Hi-Tec announce a partnership based around development of processes on Evatec’s CLUSTERLINE® 300 II.

SkyWater chooses Evatec

SkyWater has chosen CLUSTERLINE® 300 equipped with high performance evaporation technology for new process developments.