22nd July 2020


CLUSTERLINE® 600 is qualified at the major OSATS and IDMs for Panel Level Packaging. It enables the latest technologies on panel sizes up to 650 x 650 mm


Find out how our degas, etch and deposition technologies combined with Evatec's panel handling capabilities provide low contact resistance (Rc) , excellent adhesion and low particle generation in production of seed layers for IC Substrates and FOPLP.


 To visit the CLUSTERLINE® 600 web page and download the brochure click here