WIRELESS COMMUNICATION

Thin film production platforms and processes for wireless technologies

From the latest high performance RF switches to the broader development of the 5G wireless devices our evaporation and sputter platforms support a portfolio of thin film processes for wireless communication applications. We deliver sputter processes and platforms for the gap filling and planarization required for temperature compensation of IDT structures. Our evaporation process specialists offer platforms and processes for "lift off" metallization in HBT and p-HEMT manufacturing, while our piezoelectric specialists offer sputter deposition of high performance piezoelectrics like AlScN for RF filter technology.

Our tools and processes ensure for best in class thickness and stress uniformities for high production yields on wafer sizes up to 200mm.

THE EVATEC TOOL PORTFOLIO FOR WIRELESS

Choose from the Evatec platforms according to your process requirements, throughput and factory integration requirements.  

Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.

BAK FAMILY

Production proven family of evaporators. Choose from standard or extended throw with additional split chamber split option for "lift off" processes up to 8 inch with reduced precious metals consumption and enhanced throughputs.

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CLUSTERLINE® 200  

From single substrate processing for deposition of electrodes and piezoelectrics required for FBARS to dynamic batch processing for gap filling and planarization processes on 8 inch in TC - SAW devices 

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SAW and BAW   

Our thin film processes using evaporation or sputter support the manufacture of existing and next generation low loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" or "Autoload" cassette-to-cassette handling whilst dedicated cathode technology on our

CLUSTERLINE® 200 II platform enables the deposition of piezoelectric materials such as AlN and AlScN with a highest degree of crystal orientation and controlled stress for resonators, reflectors and electrodes.

Metallization Processes  

Evatec evaporation platforms for contact and seed layers deliver reduced precious metals consumption using proprietary software like Unicalc. Systems with extended throw are optimized for "lift off" process geometries where subsequent film patterning steps call for zero side wall coverage. Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.

Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.

From the latest high performance RF switches to the broader development of the 5G wireless devices our evaporation and sputter platforms support a portfolio of thin film processes for wireless communication applications. We deliver sputter processes and platforms for the gap filling and planarization required for temperature compensation of IDT structures. Our evaporation process specialists offer platforms and processes for "lift off" metallization in HBT and p-HEMT manufacturing, while our piezoelectric specialists offer sputter deposition of high performance piezoelectrics like AlScN for RF filter technology.

Our tools and processes ensure for best in class thickness and stress uniformities for high production yields on wafer sizes up to 200mm.

THE EVATEC TOOL PORTFOLIO FOR WIRELESS

Choose from the Evatec platforms according to your process requirements, throughput and factory integration requirements.  

Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.

SAW and BAW   

Our thin film processes using evaporation or sputter support the manufacture of existing and next generation low loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" or "Autoload" cassette-to-cassette handling whilst dedicated cathode technology on our

CLUSTERLINE® 200 II platform enables the deposition of piezoelectric materials such as AlN and AlScN with a highest degree of crystal orientation and controlled stress for resonators, reflectors and electrodes.

Metallization Processes  

Evatec evaporation platforms for contact and seed layers deliver reduced precious metals consumption using proprietary software like Unicalc. Systems with extended throw are optimized for "lift off" process geometries where subsequent film patterning steps call for zero side wall coverage. Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.

Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.