31st October 2023

LAYERS 7 – Low temperature PVD deposition of low stress SiN and SiCN films for Hybrid Bonding applications

Intel’s Dr. Xavier Brun, and Evatec’s Dr. Patrick Carazzetti and Ewald Strolz investigate the feasibility of high quality low stress SiN and SiCN film deposition on Evatec’s CLUSTERLINE® at low temperatures without adversly affecting tool productivity. Results confirm the possibility of achieving good uniformities (<3% 1σ) for up to 2.0µm films, and optimization of SiN film stress (100MPa) independent of film thickness.
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