A choice of architectures

The CLUSTERLINE® 200 can be configured as a tool for single substrate or batch processing using Single Process Modules (SPM) or a Batch Process Module (BPM) respectively. However you configure the tool, you can rely on fully automated cassette-to-cassette processing using Evatec's proven safe handling. For custom applications please also enquire configurations combining both single and batch process modules.

SPM configuration highlights

Platform variant with strong pedigree in Power Devices, Advanced Packaging, MEMS and Wireless markets allowing easy tool configuration and future expansion for PVD, highly ionized PVD, Soft Etch and PECVD for wafer sizes up to 200mm.

  • Modular chuck design for rapid exchange between 100, 150 or 200mm formats for production flexibility and maximum tool utilization
  • Up to 6 single process modules and up to 6 auxiliary modules for pre- and post treatment steps
  • Auxiliary module functions including wafer alignment, buffer, degas, cooling, and ID reader
  • Direct thin wafer handling and processing capability for thicknesses down to 70microns

 

BPM configuration highlights

Platform variant combining the benefits of sputter batch processing with completely automated handling for selected applications in MEMS and Wireless. A true work horse LED / Micro Display and Photonics industries. Integration of additional plasma sources opens up process possibilities for enhanced deposition processes e.g coating modification including gap filling and planarization. 

  • Batch processing of up to 20+1 6 inch substrates simultaneously
  • Batch processing of up to 15+1  8 inch substrates simultaneously
  • Rotating substrate table with option for individual rotating substrate chucks 
  • Integration of up to 4 PVD sputter sources plus 1 plasma source

 

Main elements include

Platform

  • Two loadlock cassette stations-ergonomic loading, soft pump and soft vent, mapping functions to detect cross-slotted, double-loaded wafers, instant wafer slide out (protrusion) detection
  • Magnetically driven robot system with dual bisymmetric arms

 

Process Modules / Components

  • Production-proven planar magnetron sputter sources (RF & DC) with high target utilization (rotating magnetic system) or Flexicath™ for extremely high film uniformity and homogeneity requirements
  • Highly ionized PVD source technology for high aspect ratio TSV applications - mainly for 3D packaging
  • The PLASMABOX® design of the PECVD process module provides outstanding uniformity and avoids contamination by differential pumping and in-situ cleaning. The concept allows a very high film purity and excellent control of interfaces and doping
  • ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2, N2 and O2 is available
  • Cooled Metal Cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO
  • Degas module for fast wafer conditioning and repeatable process results
  • Electrostatic (ESC), clampless or clamped chucks using gas conduction for active wafer cooling or heating in PVD and soft etch modules with chuck RF Bias
  • Multisource with rotating chuck - up to 4 mixed DC & RF sources on one module for single target or simultaneous sputtering
  • Controlled chuck temperature from -30 up to 800°C
  • Magnetic alignment feature to orient magnetic films
  • Optional APC with fully integrated Pyrometer and process gas monitor

 

Download the brochure

To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with single process module (SPM) technology click here 

 

Platform Overview

  • 4 sided platform as standard for integration of BPM with dual load lock at front end
  • Processing of up to 20pcs 6 inch substrates or 15pcs 8 inch substrates simultaneously
  • Soft etch, heating and cooling capability to enhance your layer quality or protect your substrates
  • Fully "Semi" standards compliant handler compatible with integration of wafer aligner
  • Batch Process Module BPM integrating rotating substrate table with adjustable source to substrate distance, customized chuck and clamp designs e.g. edge grip or full face deposition and heating up to 350°C
  • Upstream or downstream process gas control
  • Direct substrate or carrier handling for rapid exchange between substrate formats for flexibility and maximum tool utilization.
  • Flip system for double sided coating without vacuum break
  • Rotating target technology for high rate and uniformity in optical interference coating

 

Advanced Process Control (APC) comes as standard

Here are just some of the “in-situ” techniques available according to the application and process

  • Plasma Emission Monitoring (PEM) for correct stoichiometry in reactive oxide processes
  • Broadband optical monitoring (GSM) with in-situ reoptimization for the most accurate layer end point termination and overall control of optical performance of optical stacks

 

Download the brochure

To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with batch process module (BPM) technology click here 

 

 

Proven production capabilities come as standard when you choose CLUSTERLINE® 200. Evatec process and know-how covers materials including high performance piezo electrics, magnetics, metals and dielectrics.

From plasma damage free deposition of TCOs, DBRS and contacts on GaN in LED production to the highly repeatable deposition of single double sided coatings for 3D imaging and Gesture Recognition for the next generation smart phones, CLUSTERLINE® 200 platforms come with proven capability in deposition of thin film stacks with precise control over parameters such as stress, stoichiometry, refractive index.

To read more about typical application examples download the brochure(s) or visit the news section of our web site.

 

 

 

A choice of architectures

The CLUSTERLINE® 200 can be configured as a tool for single substrate or batch processing using Single Process Modules (SPM) or a Batch Process Module (BPM) respectively. However you configure the tool, you can rely on fully automated cassette-to-cassette processing using Evatec's proven safe handling. For custom applications please also enquire configurations combining both single and batch process modules.

SPM configuration highlights

Platform variant with strong pedigree in Power Devices, Advanced Packaging, MEMS and Wireless markets allowing easy tool configuration and future expansion for PVD, highly ionized PVD, Soft Etch and PECVD for wafer sizes up to 200mm.

  • Modular chuck design for rapid exchange between 100, 150 or 200mm formats for production flexibility and maximum tool utilization
  • Up to 6 single process modules and up to 6 auxiliary modules for pre- and post treatment steps
  • Auxiliary module functions including wafer alignment, buffer, degas, cooling, and ID reader
  • Direct thin wafer handling and processing capability for thicknesses down to 70microns

 

BPM configuration highlights

Platform variant combining the benefits of sputter batch processing with completely automated handling for selected applications in MEMS and Wireless. A true work horse LED / Micro Display and Photonics industries. Integration of additional plasma sources opens up process possibilities for enhanced deposition processes e.g coating modification including gap filling and planarization. 

  • Batch processing of up to 20+1 6 inch substrates simultaneously
  • Batch processing of up to 15+1  8 inch substrates simultaneously
  • Rotating substrate table with option for individual rotating substrate chucks 
  • Integration of up to 4 PVD sputter sources plus 1 plasma source

 

Main elements include

Platform

  • Two loadlock cassette stations-ergonomic loading, soft pump and soft vent, mapping functions to detect cross-slotted, double-loaded wafers, instant wafer slide out (protrusion) detection
  • Magnetically driven robot system with dual bisymmetric arms

 

Process Modules / Components

  • Production-proven planar magnetron sputter sources (RF & DC) with high target utilization (rotating magnetic system) or Flexicath™ for extremely high film uniformity and homogeneity requirements
  • Highly ionized PVD source technology for high aspect ratio TSV applications - mainly for 3D packaging
  • The PLASMABOX® design of the PECVD process module provides outstanding uniformity and avoids contamination by differential pumping and in-situ cleaning. The concept allows a very high film purity and excellent control of interfaces and doping
  • ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2, N2 and O2 is available
  • Cooled Metal Cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO
  • Degas module for fast wafer conditioning and repeatable process results
  • Electrostatic (ESC), clampless or clamped chucks using gas conduction for active wafer cooling or heating in PVD and soft etch modules with chuck RF Bias
  • Multisource with rotating chuck - up to 4 mixed DC & RF sources on one module for single target or simultaneous sputtering
  • Controlled chuck temperature from -30 up to 800°C
  • Magnetic alignment feature to orient magnetic films
  • Optional APC with fully integrated Pyrometer and process gas monitor

 

Download the brochure

To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with single process module (SPM) technology click here 

 

Platform Overview

  • 4 sided platform as standard for integration of BPM with dual load lock at front end
  • Processing of up to 20pcs 6 inch substrates or 15pcs 8 inch substrates simultaneously
  • Soft etch, heating and cooling capability to enhance your layer quality or protect your substrates
  • Fully "Semi" standards compliant handler compatible with integration of wafer aligner
  • Batch Process Module BPM integrating rotating substrate table with adjustable source to substrate distance, customized chuck and clamp designs e.g. edge grip or full face deposition and heating up to 350°C
  • Upstream or downstream process gas control
  • Direct substrate or carrier handling for rapid exchange between substrate formats for flexibility and maximum tool utilization.
  • Flip system for double sided coating without vacuum break
  • Rotating target technology for high rate and uniformity in optical interference coating

 

Advanced Process Control (APC) comes as standard

Here are just some of the “in-situ” techniques available according to the application and process

  • Plasma Emission Monitoring (PEM) for correct stoichiometry in reactive oxide processes
  • Broadband optical monitoring (GSM) with in-situ reoptimization for the most accurate layer end point termination and overall control of optical performance of optical stacks

 

Download the brochure

To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with batch process module (BPM) technology click here 

 

 

Proven production capabilities come as standard when you choose CLUSTERLINE® 200. Evatec process and know-how covers materials including high performance piezo electrics, magnetics, metals and dielectrics.

From plasma damage free deposition of TCOs, DBRS and contacts on GaN in LED production to the highly repeatable deposition of single double sided coatings for 3D imaging and Gesture Recognition for the next generation smart phones, CLUSTERLINE® 200 platforms come with proven capability in deposition of thin film stacks with precise control over parameters such as stress, stoichiometry, refractive index.

To read more about typical application examples download the brochure(s) or visit the news section of our web site.

 

 

 

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