CLUSTERLINE® 300

Cluster architecture for 300mm

 

The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology.

System Highlights

Choose CLUSTERLINE® 300 II for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics.

  • Integration of single process modules for PVD, highly ionized PVD, and Soft Etch
  • Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; carrier solution for thinner wafers
  • 200/300mm bridge or split tool compliant
  • New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications
  • Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm
  • Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)
  • SCARA robot options with 3-axis to 5-axis
  • Wafer flip station for back side metallization and buffer station for up to 6 wafers

 

Batch Module Drum (BMD) Technology

For custom applications such as manufacture of integrated voltage regulators directly on the microprocessor package the tool can now be configured with up to 2 unique batch processing modules. These enable cost effective deposition of soft magnetics on 300mm. 

According to your application requirements the tool can also be configured with a single BMD and up to 3 Single Process Modules (SPM).  Click here to read more about our BMD technology 

 

Platform

  • Magnetically driven robot system with dual bi-symmetric arms
  • Production-proven wafer handling and processing capability for thin wafers
  • Most accurate wafer placement and automatic wafer alignment correction under vacuum
  • Integration of up to six single substrate processing modules (SPMs), 2 batch drum modules (BDM) or a mixture

 

Process Modules / Components

  • ICP soft etch module - SiO2 removal rate, 0.6 - 0.8 nm/sec
  • Highly ionized PVD source for high aspect ratio TSV applications - mainly for 3D packaging
  • Controlled chuck temperature from -30 up to 500°C
  • Metal or ceramized chuck with mechanical wafer clamping
  • ESC or clampless chuck with shadow mask
  • Clamped chuck configuration with gas conduction back side heater/cooler for precise temperature control and chuck RF Bias
  • ARQ 310 DC or pulsed DC sputter source with uniformity compensation over target life
  • Multisource with rotating chuck - up to 4 RF or DC sources on one module for single or co-sputter
  • Optional APC with fully integrated Pyrometer and process gas monitor
  • Optimized configuration for organic/mold substrates
  • ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2, N2 and O2 is available
  • Cooled Metal Cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO
  • Atmospheric Batch Degasser with 44 slots for strongly degassing Advanced Packaging Substrates
  • BMD batch module drum(s) for deposition of soft magnetic layers on 300mm

 

Download the brochure

To download the brochure about the hardware and process capabilities of CLUSTERLINE® 300 equipped with single process module (SPM) technology click here 

 

To read more about capabilities of Evatec's batch module drum ( BMD)  technology click here

 

Proven process capabilities come as standard when you choose CLUSTERLINE® 300 for a range of applications in Advanced Packaging, Power Devices, and Optoelectronics.

To read more about typical application examples download the CLUSTERLINE® FAMILY brochure or visit the news section of our website. Within LAYERS you can read about applications including OLED on CMOS and Integrated Voltage Regulators assembled directly on the microprocessor package.

 

The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology.

System Highlights

Choose CLUSTERLINE® 300 II for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics.

  • Integration of single process modules for PVD, highly ionized PVD, and Soft Etch
  • Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; carrier solution for thinner wafers
  • 200/300mm bridge or split tool compliant
  • New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications
  • Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm
  • Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)
  • SCARA robot options with 3-axis to 5-axis
  • Wafer flip station for back side metallization and buffer station for up to 6 wafers

 

Batch Module Drum (BMD) Technology

For custom applications such as manufacture of integrated voltage regulators directly on the microprocessor package the tool can now be configured with up to 2 unique batch processing modules. These enable cost effective deposition of soft magnetics on 300mm. 

According to your application requirements the tool can also be configured with a single BMD and up to 3 Single Process Modules (SPM).  Click here to read more about our BMD technology 

 

Platform

  • Magnetically driven robot system with dual bi-symmetric arms
  • Production-proven wafer handling and processing capability for thin wafers
  • Most accurate wafer placement and automatic wafer alignment correction under vacuum
  • Integration of up to six single substrate processing modules (SPMs), 2 batch drum modules (BDM) or a mixture

 

Process Modules / Components

  • ICP soft etch module - SiO2 removal rate, 0.6 - 0.8 nm/sec
  • Highly ionized PVD source for high aspect ratio TSV applications - mainly for 3D packaging
  • Controlled chuck temperature from -30 up to 500°C
  • Metal or ceramized chuck with mechanical wafer clamping
  • ESC or clampless chuck with shadow mask
  • Clamped chuck configuration with gas conduction back side heater/cooler for precise temperature control and chuck RF Bias
  • ARQ 310 DC or pulsed DC sputter source with uniformity compensation over target life
  • Multisource with rotating chuck - up to 4 RF or DC sources on one module for single or co-sputter
  • Optional APC with fully integrated Pyrometer and process gas monitor
  • Optimized configuration for organic/mold substrates
  • ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2, N2 and O2 is available
  • Cooled Metal Cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO
  • Atmospheric Batch Degasser with 44 slots for strongly degassing Advanced Packaging Substrates
  • BMD batch module drum(s) for deposition of soft magnetic layers on 300mm

 

Download the brochure

To download the brochure about the hardware and process capabilities of CLUSTERLINE® 300 equipped with single process module (SPM) technology click here 

 

To read more about capabilities of Evatec's batch module drum ( BMD)  technology click here

 

Proven process capabilities come as standard when you choose CLUSTERLINE® 300 for a range of applications in Advanced Packaging, Power Devices, and Optoelectronics.

To read more about typical application examples download the CLUSTERLINE® FAMILY brochure or visit the news section of our website. Within LAYERS you can read about applications including OLED on CMOS and Integrated Voltage Regulators assembled directly on the microprocessor package.

 

CLUSTERLINE® FAMILY - IN THE NEWS