1st January 2019


It’s already a year since Evatec’s market introduction of the PNL 500 panel level processing tool to the Advanced Packaging market. Process Engineer, Johannes Weichart gives us an update on capabilities and performance levels of the latest tools off the production line as customer process demands and production cost targets get even tougher for 2019 and beyond

The PNL 500 proves itself

The PNL 500 tool already proved itself over the last 12 months in customer production lines as well as working as a sampling platform for future customers in Evatec’s own Advanced Packaging Competence Centre (APCC). Important product quality criteria like good contact resistance performance, adhesion, yield and reliability could all be achieved on various customer substrates for the Fan Out Panel Level Packaging (FOPLP) or the advanced Printed Circuit Board (PCB) markets.

This is an extract from an article in LAYERS 4. Edition 2018/2019. To read the full article click here