1st January 2019


Dr. Bill Shi, CEO of TFME, explains his vision for the company and the importance of close partnership with key suppliers to meet the growing future technology demands of TFME’s own customers.


Working hard to fulfill our ambition

TFME has the vision to become a worldwide leading company in the Semiconductor Packaging & Testing industry, and with more than half of the global top ten semiconductor manufacturers as our major customers already and a global customer base of more than 300 I believe we are well on our way.

Quality and reliability of product are key success factors (KSFs) of semiconductor industry, especially within advanced packaging. As a market leader, TFME focuses on developing innovative technology, smart manufacturing and differentiated solutions to provide high quality, reliable solutions that meet our customers expectations. For example, we were the first China based corporation to realise the mass production of 12 inch 28nm mobile phone processor chip backend processes, including Bumping, CP, FC, FT and SLT. 10nm processes are already qualified and 7nm processes are now under qualification.

But achieving our vison requires constant development, working together with equipment and material suppliers to enhance the levels of technology and service we can provide......... 


This is an extract from an article in LAYERS 4. Edition 2018/2019. To read the full article click here