SOLARIS® S151

High speed processing for substrates / carriers up to 8inch diagonal

The "inline" SOLARIS® S151 offers easy tool configuration and scope for future expansion for multiple processes and substrate sizes up to 8 inch diagonal. Proven manufacturing performance combined with easy size conversion provides excellent utilization and CoO.

Choose SOLARIS® S151 for selected processes in Power Devices, Optoelectronics and Photonics.

The 6 process stations of SOLARIS® S151 can be equipped with capability for RTP, PVD, Etch or CVD. Direct substrate or carrier handling for mini batches without compromise in process quality provide flexibility for changes of process. 

Tool highlights

  • Quick change over from one substrate size to another with carrier system
  • Carrier loading / unloading included in the machine design
  • Small footprint and low operating costs
  • Flexible configurations allowed - each process station is separated from the other
  • Multi layer capability – each chamber can operate different processes and deposit different materials
  • Multi Source Sputtering – alloy development with up to 4 different materials
  • Substrate rotation during sputtering ensures layer uniformity better than ±2%
  • Coated area up to 225mm diameter
  • Film annealing with heater up to 550°C
  • Surface cleaning and activation by etching
  • Easy integration into fab automation
  • Target and shield change time max. 30min

 

From Augmented Reality to Photovoltaics and Power Device applications, SOLARIS® S151 offers high speed repeatability for deposition of a whole range of materials. 

Choose from large area single DC, DC Reactive or RF sputter with cooling, etch and RTP capabilities up to 550C, or Evatec multisource capability for up to 4 sputter cathodes at a single process station. All process modules run independently in isolation and are configured according to your application.

  • Dielectrics: SiN-H, SiN, SiO2, Al2O3, SiC

  • Metal Oxides: NbO2, TiO2, Ta2O5

  • TCOs: ITO, GZO, Zn:AlO

  • Metal stacks: Al, NiV, Ag, AuGe

  • Alloys with MSQ multisource

  • Deposition uniformities <±2% over whole carrier

For more information about SOLARIS® capabilities download the brochure, take a look at some of the stories in Evatec's LAYERS magazine or contact your local sales and service organization.

The "inline" SOLARIS® S151 offers easy tool configuration and scope for future expansion for multiple processes and substrate sizes up to 8 inch diagonal. Proven manufacturing performance combined with easy size conversion provides excellent utilization and CoO.

Choose SOLARIS® S151 for selected processes in Power Devices, Optoelectronics and Photonics.

The 6 process stations of SOLARIS® S151 can be equipped with capability for RTP, PVD, Etch or CVD. Direct substrate or carrier handling for mini batches without compromise in process quality provide flexibility for changes of process. 

Tool highlights

  • Quick change over from one substrate size to another with carrier system
  • Carrier loading / unloading included in the machine design
  • Small footprint and low operating costs
  • Flexible configurations allowed - each process station is separated from the other
  • Multi layer capability – each chamber can operate different processes and deposit different materials
  • Multi Source Sputtering – alloy development with up to 4 different materials
  • Substrate rotation during sputtering ensures layer uniformity better than ±2%
  • Coated area up to 225mm diameter
  • Film annealing with heater up to 550°C
  • Surface cleaning and activation by etching
  • Easy integration into fab automation
  • Target and shield change time max. 30min

 

From Augmented Reality to Photovoltaics and Power Device applications, SOLARIS® S151 offers high speed repeatability for deposition of a whole range of materials. 

Choose from large area single DC, DC Reactive or RF sputter with cooling, etch and RTP capabilities up to 550C, or Evatec multisource capability for up to 4 sputter cathodes at a single process station. All process modules run independently in isolation and are configured according to your application.

  • Dielectrics: SiN-H, SiN, SiO2, Al2O3, SiC

  • Metal Oxides: NbO2, TiO2, Ta2O5

  • TCOs: ITO, GZO, Zn:AlO

  • Metal stacks: Al, NiV, Ag, AuGe

  • Alloys with MSQ multisource

  • Deposition uniformities <±2% over whole carrier

For more information about SOLARIS® capabilities download the brochure, take a look at some of the stories in Evatec's LAYERS magazine or contact your local sales and service organization.