SOLARIS® S151
Inline architecture for 200mm
SOLARIS® S151
The "inline" SOLARIS® S151 offers easy tool configuration and scope for future expansion for multiple processes and substrate sizes up to 8 inch diagonal. Proven manufacturing performance combined with easy size conversion provides excellent utilization and CoO.
Choose SOLARIS® S151 for selected processes in Power Devices, Optoelectronics and Photonics.
S151 – a quick guide
Click on the individual sections in the circle form a quick guide to major components and capabilities or read more details below
Vacuum
- Turbo molecular pumps combined with dry rotary pumps
- Ultimate pressure in the low E‑7 mbar range
- Each process chamber equipped with an individual pump
- Complete vacuum separation during processing
- Minimal cross-over during substrate transfer between chambers
PVD Single Source
- DC, DC reactive, or 13.56 MHz RF sputter sources available
- Single-target sources with standard 300mm target diameter
- Individual chamber venting for target exchange
PVD Multi Source
- Enables material engineering via simultaneous sputtering of different materials
- DC, DC reactive, or 13.56 MHz RF sputter sources available
- Any combination of up to four individual sources per chamber
- Standard target diameter of ø100 mm
Etch Source
- Hard etching of metals and/or oxides
- Optional glow discharge cleaning station
- Removes organic residues from substrate surfaces
- Improves adhesion through surface activation
Cooling Source
- Rapid cooldown of heated substrates
- Performed in an individual dedicated chamber
- Prevents substrates from exceeding defined temperature limits
RTP Source
- Rapid substrate heating in an individual chamber
- Heating capability up to 400 °C
- Prepares substrates prior to coating processes
Process chambers
Equip the system with up to 6 process chambers configured for:
- Continuous substrate rotation during processing to ensure excellent angular uniformity across the substrate
- Individual chamber venting for fast target exchange
Substrate management
- Dedicated substrate carriers for specific substrate geometries
- Supports substrates of any shape
- Maximum substrate thickness up to 4 mm
System Concept and Architecture
The SOLARIS® S151 offers a modular inline design for continuous carrier-based processing with high uptime and throughput. Inline substrate transport with synchronized carrier indexer
- Up to six process stations and a total of seven chamber modules (incl. load / unload)
- Independent process modules for PVD, Etch or RTP
- Integrated carrier loading and unloading within the tool design
- Quick substrate-size conversion via carrier exchange
- Compact footprint and low utilities for reduced cost of ownership
- Factory interface via GEM / SECS II
Process and Coating Technologies
Each module operates independently, ensuring repeatable results in 24/7 production.
- PVD: DC, DC reactive or RF sputtering with chamber & shoueld cooling
- Etch / Activation: surface pre-clean or plasma treatment
- RTP: inline annealing up to 400 °C
- Multisource sputtering: up to 4 cathodes per chamber
- Substrate rotation for < ± 2..3 % uniformity (depending on the process)
- Typical materials: SiN, SiO₂, Al₂O₃, ITO, TiO₂, Al, NiV, Ag, AuGe, Zn:AlO and alloys via MSQ multisource
3D Coating Capability with Rotary Sources (RSQ 250)
SOLARIS® S151 process chambers can be equipped with RSQ 250 Rotating Cylindrical Magnetron sources.
Each sputtering module features two rotary cathodes, enabling uniform 3D film deposition on structured or stepped substrates.
Continuous rotation of the cylindrical targets ensures excellent thickness uniformity, superior target utilization (> 85 %), and minimal particle generation or arcing.
Together with rotating substrate lift and precise gas-flow control, the system achieves high-quality coatings even on complex 3D geometries.
Maintenance is simplified by quick-access cathode assemblies that can be pulled back and tilted by 90° for fast target exchange.
An optional ARG 151 + RSQ 250 chamber adds in-situ glow-discharge pre-cleaning for improved adhesion and process stability.
Modularity and Upgradeability
- Exchange or add cathodes (PVD / Etch / RTP) at any time
- Handle substrates up to 200 mm or mini-batch carriers
- Target and shield change ≤ 30 min
- Independent chamber operation for multilayer flexibility
Typical Applications
- Power Devices – metallization and annealing
- Optoelectronics & Photonics – dielectric and reflective coatings
- Touch Panels – ITO, metal and TCO layers
- Photovoltaics – back-side and transparent conductive coatings
- Thermoelectrics – multilayer metal and oxide stacks
- 3D Components – uniform coatings on stepped or structured surfaces using RSQ 250 rotary sources
Read more about the SOLARIS® S151 in our LAYERS magazine
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