30th September 2021


In LAYERS 3 at the end of 2017 we reported the drive to higher throughputs and larger 8 inch wafer sizes that had lead to a shift towards larger systems like the BAK 1401 handling 24 wafers in a single batch. Available in split chamber configuration with wire feeder technology for the e-gun sources, the so called BAK 1401 SC (split chamber) systems can deliver 10 to 20% higher throughputs according to processes. Just as importantly for the most demanding process specs however, the split chamber configuration where source chamber remains under vacuum constantly delivers improvements in process repeatability or the capability to handle sensitive coating materials which would not otherwise be possible. But now we can take the “great“ and make it even better. Evatec's Martin Kratzer tells us how.

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