MEMS / NEMS

Thin films for sensing, actuating and magnetics

 

Micro-Electro-Mechanical-Systems are based on wafer processing technologies for micro machining and structuring of Advanced Functional Materials that enable the manufacture of sensors, actuators and energy harvesters. These devices are the interface between our analog world and its digital representation. From the efficient delivery of ink in our printers, to the accelerometers in our car airbags and smart gaming devices, the optical switches in our datacoms networks and the bio sensors that help keep us in good health,

we rely on the accurate preparation of microstructured films in a fast and cost efficient way. Evatec’s evaporation, sputter and PECVD technologies support the deposition of the involved metals, dielectrics, piezoelectric and magnetic materials.

THE EVATEC TOOL PORTFOLIO FOR MEMS

A heterogeneous industry requires a flexible tool manufacturer. Batch, single wafer, static or dynamic concepts are modularly combined and equipped with numerous HW features to master the fascinating characteristics of Advanced Functional Materials. R&D, small series as well as manually or automatically working systems allow you to find a tailored solution to your problem.

Find out more about the BAK Evaporator, the LLS or different members of the CLUSTERLINE® family by clicking on the picture links.

 

BAK FAMILY

Benchmark evaporator in sizes from 0.5 to 2.0 metres backed by 70 years process know-how. Flexible source and substrate handling for MEMS applications.

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LLS EVO II  

Vertical batch sputter tool with long track record. Ideal for production of smaller volumes for any functional layer at lower investment costs

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CLUSTERLINE® 200 

200mm cluster tool offering single substrate processing for piezoMEMS including RF-MEMS or batch processing technology for multilayers stacks in WLO

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CLUSTERLINE® 300

Batch processing for advantageous production of soft-magnetics in IVRs on 300mm wafers – with AFEM and standard 300mm handling

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MEMS Sensors

Sensors are based on various material-specific characteristics on top of electrical properties when exposed to physical stimuli. From sound to light, temperature, mechanical force or chemical reaction, the limits are being pushed. The resulting requirements in terms of combination and integration are truly demanding as we move from heterogeneous towards monolithic integration. MEMS are the very protagonists on the edges and for the connectivity of the IoT.

With 70 years of experience Evatec can offer a wide range of deposition technologies and process know-how to influence the properties of the resulting thin films. From evaporators to dynamic sputter concepts on the LLS EVO II or classic single wafer manufacturing on our flexible CLUSTERLINE® 200, Evatec has the right tool for your MEMS requirements.

Piezo MEMS

The market of devices based on the piezoelectric effects is continuously growing. The classic high-volume business for Wireless Communication is more and more complemented by ultrasonic transducers, microphones, speakers. Deposition of materials with high piezoelectric coefficients and better electro-mechanical coupling such as AlN, AlScN or PZT on our CLUSTERLINE® 200 II platform support production of highly sensitive elements or actuators. Forces and displacements of moving structures generate electrical energy and vice versa with highest efficiency. Stress control is mastered and remains adjustable while coupling coefficients or SNRs are best in class.

Integrated Voltage Regulators & Magnetic MEMS

Beyond magnetic sensors and TFH-technologies on our CLUSTERLINE® 200 II and LLS EVO systems, we have derived the necessary technology and tool concept to deposit soft-magnetic layers for the cores of on-chip inductors on CLUSTERLINE® 300 with the BMD module. This newly released tool takes proven technology from 200mm making it available for 300mm substrates with significant advantages in terms of throughput and resulting cost of ownership.

Optical MEMS

Semiconductor industry precision in wafer handling comes together with Evatec's Advanced Process Control for control of optical layers to enable high yields in manufacture of the the proximity, ambient light and color rendering management sensors used in today’s smart phone technologies. In-situ reoptimization on platforms like CLUSTERLINE® 200  equipped with Batch Process Module (BPM) technology offers security in production of complex optical stacks on high value wafers. We mention these highlights in the MEMS chapter since many of those optical layers are deposited on micro-mirrors or tuneable lenses and this is where MEMS actuators – piezo or capacitive – come in to play. For know-how in optical interference coatings please also refer to the Photonics section of our website.

Micro-Electro-Mechanical-Systems are based on wafer processing technologies for micro machining and structuring of Advanced Functional Materials that enable the manufacture of sensors, actuators and energy harvesters. These devices are the interface between our analog world and its digital representation. From the efficient delivery of ink in our printers, to the accelerometers in our car airbags and smart gaming devices, the optical switches in our datacoms networks and the bio sensors that help keep us in good health,

we rely on the accurate preparation of microstructured films in a fast and cost efficient way. Evatec’s evaporation, sputter and PECVD technologies support the deposition of the involved metals, dielectrics, piezoelectric and magnetic materials.

THE EVATEC TOOL PORTFOLIO FOR MEMS

A heterogeneous industry requires a flexible tool manufacturer. Batch, single wafer, static or dynamic concepts are modularly combined and equipped with numerous HW features to master the fascinating characteristics of Advanced Functional Materials. R&D, small series as well as manually or automatically working systems allow you to find a tailored solution to your problem.

Find out more about the BAK Evaporator, the LLS or different members of the CLUSTERLINE® family by clicking on the picture links.

 

MEMS Sensors

Sensors are based on various material-specific characteristics on top of electrical properties when exposed to physical stimuli. From sound to light, temperature, mechanical force or chemical reaction, the limits are being pushed. The resulting requirements in terms of combination and integration are truly demanding as we move from heterogeneous towards monolithic integration. MEMS are the very protagonists on the edges and for the connectivity of the IoT.

With 70 years of experience Evatec can offer a wide range of deposition technologies and process know-how to influence the properties of the resulting thin films. From evaporators to dynamic sputter concepts on the LLS EVO II or classic single wafer manufacturing on our flexible CLUSTERLINE® 200, Evatec has the right tool for your MEMS requirements.

Piezo MEMS

The market of devices based on the piezoelectric effects is continuously growing. The classic high-volume business for Wireless Communication is more and more complemented by ultrasonic transducers, microphones, speakers. Deposition of materials with high piezoelectric coefficients and better electro-mechanical coupling such as AlN, AlScN or PZT on our CLUSTERLINE® 200 II platform support production of highly sensitive elements or actuators. Forces and displacements of moving structures generate electrical energy and vice versa with highest efficiency. Stress control is mastered and remains adjustable while coupling coefficients or SNRs are best in class.

Integrated Voltage Regulators & Magnetic MEMS

Beyond magnetic sensors and TFH-technologies on our CLUSTERLINE® 200 II and LLS EVO systems, we have derived the necessary technology and tool concept to deposit soft-magnetic layers for the cores of on-chip inductors on CLUSTERLINE® 300 with the BMD module. This newly released tool takes proven technology from 200mm making it available for 300mm substrates with significant advantages in terms of throughput and resulting cost of ownership.

Optical MEMS

Semiconductor industry precision in wafer handling comes together with Evatec's Advanced Process Control for control of optical layers to enable high yields in manufacture of the the proximity, ambient light and color rendering management sensors used in today’s smart phone technologies. In-situ reoptimization on platforms like CLUSTERLINE® 200  equipped with Batch Process Module (BPM) technology offers security in production of complex optical stacks on high value wafers. We mention these highlights in the MEMS chapter since many of those optical layers are deposited on micro-mirrors or tuneable lenses and this is where MEMS actuators – piezo or capacitive – come in to play. For know-how in optical interference coatings please also refer to the Photonics section of our website.

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