7th October 2021


Electronics Packaging - From Afterthought to Product Differentiator

As President & Founder of ESPAT-Consulting based in Dresden, Germany, Steffen  provides a wide range of consulting services around Semiconductor Packaging, Assembly and Test, mainly for customers in Europe.  Over the last 20 years he has worked in different R&D, engineering and management positions at large IDMs and OSATs in Germany and Portugal, namely Siemens Semiconductors, Infineon Technologies, Qimonda, NANIUM and Amkor Technology, where he most recently served as Senior Director Technology Development. Since 2016 Steffen has chaired the European SEMI integrated Packaging, Assembly and Test - Technology Community (ESiPAT-TC).  Read his thoughts on the Advanced Packaging Industry and the emerging opportunities for Foundaries, IDMs and Suppliers. 

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