18th August 2021

Panel Level Packaging Consortium - The first Year

The PLC 2.0 project shows excellent progress. New equipment for panel level packaging has been installed during the run-up to the PLC 2.0. The project benefits from several major investments from the German Federal Ministry of Education and Research in the Research Fab Microelectronics Germany. However, due to the restrictions imposed on laboratory work and limited access to the research network of the Fraunhofer IZM during lockdown in the course of the global COVID-19 pandemic, the work plan for the PLC2.0 has been extended by 4 months. All meetings of the first year have been organized as virtual meetings with 2 dedicated sessions for Asia and US time zones.

To view the full Fraunhofer press release including details of the co-operation and results so far  CLICK HERE