LAYERS 9 – Innovations and Opportunities in Panel Level Packaging
Panel Level Packaging is entering a new phase of growth, driven by modular chiplet architectures for artificial intelligence and high‑performance computing. Larger substrates enable higher integration density, improved bandwidth, and better thermal performance. Recognizing this early on, Evatec has been actively shaping the Panel Level Packaging market for almost a decade, developing PVD solutions tailored to emerging panel formats.
Building on this experience, Evatec is now extending its technology roadmap from wafer based processes toward panel formats starting at 310 by 310 millimeters and scaling further to sizes up to 650 by 650 millimeters. These developments are focused on key applications such as redistribution layers, backside metallization, through glass via technologies, and plasma based etching processes for advanced substrates.
For redistribution layer and backside metallization processes, Evatec has launched a dedicated development project based on the CLUSTERLINE® 300 platform. The modified system is designed to handle panels efficiently while increasing substrate utilization per cycle. This enables higher throughput and lower cost per chip, supporting larger AI chiplets and advanced memory integration. New sputter and etch modules, improved sources, and in situ process control are under development to ensure high uniformity and optimized material usage.
Glass based interposers are also gaining importance in high frequency and RF packaging. Evatec is preparing its CLUSTERLINE® 600 platform for thin film deposition on large glass panels, with a roadmap covering adhesion layers and copper seed layers for through glass vias with increasing aspect ratios. Ionized plasma capabilities will enable conformal coverage along via sidewalls for reliable interconnect performance.
In parallel, Evatec is expanding its portfolio with reactive ion etching and desmear solutions for organic and glass substrates. These developments aim to deliver scalable and production ready solutions that support the evolving needs of advanced Panel Level Packaging.
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