Quicker, smaller, lighter and less power hungry. We all want electronic devices that do more and cost less to buy and own. Packaging technology is key, technology that enables smaller feature sizes, handles organic materials and drives down costs. Our new HEXAGON is the perfect choice for FOWLP, delivering the lowest Rc values at the best cost of ownership. Watch the movie now to learn more.
Contact us now to discuss how HEXAGON can support your thin film processes for WLCSP and FanOut on 200 and 300mm.