The new HEXAGON is here. Our new HEXAGON is the perfect choice for FOWLP, delivering the lowest Rc values at the best cost of ownership.
Find out moreWith more process capabilities, a more compact footprint and even more throughput the new HEXAGON simply gives you more when it comes to Fan-out Wafer Level Processing (FOWLP). Watch the video preview now.
The new HEXAGON maintains the existing strengths of proven and reliable processes, high throughput and then offers significant improvements and innovations in the areas of process capabilities, throughput, uptime, accessibility and serviceability.
Find out moreProcess 300 or 200 mm substrates with highest throughput achieving lowest Rc in the industry. HEXAGON is the production platform that puts you ahead in UBM, RDL and Fanout.
Find out moreFind out in the study of Fraunhofer and Evatec why HEXAGON PVD systems are ideal for modern WLP applications.
Find out moreEvatec Advanced Packaging group wins supplier award at SJ SEMICONDUCTOR CORPORATION.
Find out moreThe 7th edition of our thin film technology magazine “LAYERS” has just been released. Get a taste of what’s inside and order your copy now.
Find out moreFind out how Evatec's evaporation and sputter technology know-how can help you increase your yields and drive down your costs.
Find out moreFrom modification of sensitive coatings to high rate layer removal, read more about Evatec plasma source technology covering applications at wafer or panel level.
Find out moreLearn about our innovative thin film solutions for wafer and panel level packaging applications such as WLCSP, FO WLP, FO PLP, 2.5D, 3D and advanced IC substrates.
Find out moreOur technology has been shaping the world for over 70 years. Find out more about our company, our products and how Evatec thin films are everywhere in our daily lives.
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