SOLARIS® S380
Inline architecture for 15inch diagonal
The "inline" SOLARIS® S380 offers easy tool configuration and scope for future expansion for multiple processes and substrate sizes. It handles carriers up to 15 inch diagonal. Proven manufacturing performance combined with easy size conversion provides excellent utilization and CoO.
Choose SOLARIS® S380 for selected high volume processes like chip scale EMI shielding or touch panel.
SOLARIS® S380 offers integration of sputter, heating / annealing and CVD technology on up to 5 process stations.
Tool Highlights
- Quick change over from one substrate size to another with carrier system
- Carrier loading / unloading included in the machine design
- Small footprint and low operating costs
- Flexible configurations allowed - each process station is separated from the other
- Multi layer capability – each chamber can operate different processes and deposit different materials
- Multi Source Sputtering – alloy development with up to 4 different materials
- Substrate rotation during sputtering ensures layer uniformity better than ±2%
- coated area up to 380mm diameter
- Film annealing with heater up to 550°C
- Surface cleaning and activation by etching
- Easy integration into fab automation
- Total down time for target and shield change max. 60min
Choose from large area single DC, DC Reactive or RF sputter with cooling, etch and RTP capabilities up to 550°C, Evatec multisource capability for up to 4 sputter cathodes at a single process module or custom sources for deposition of materials like Parylene.
All process modules run independently in isolation and are configured according to your application.
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Dielectrics: SiN-H, SiN, SiO2, Al2O3, SiC
-
Metal Oxides: NbO2, TiO2, Ta2O5
-
TCOs: ITO, GZO, Zn: AlO
-
Metal stacks: Al, NiV, Ag, AuGe
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Alloys with MSQ multisource
-
Deposition uniformities <±2% over whole carrier
-
Parylene coatings - C, N and F with superior uniformities and reduced dimer usage
Additional custom source technologies like Evatec's "Penta Plus" cathodes deliver precise step coverage solutions in applications like EMI shielding.
For more information about SOLARIS® capabilities download the brochure, take a look at some of the stories in Evatec's LAYERS magazine or contact your local sales and service organization.
The "inline" SOLARIS® S380 offers easy tool configuration and scope for future expansion for multiple processes and substrate sizes. It handles carriers up to 15 inch diagonal. Proven manufacturing performance combined with easy size conversion provides excellent utilization and CoO.
Choose SOLARIS® S380 for selected high volume processes like chip scale EMI shielding or touch panel.
SOLARIS® S380 offers integration of sputter, heating / annealing and CVD technology on up to 5 process stations.
Tool Highlights
- Quick change over from one substrate size to another with carrier system
- Carrier loading / unloading included in the machine design
- Small footprint and low operating costs
- Flexible configurations allowed - each process station is separated from the other
- Multi layer capability – each chamber can operate different processes and deposit different materials
- Multi Source Sputtering – alloy development with up to 4 different materials
- Substrate rotation during sputtering ensures layer uniformity better than ±2%
- coated area up to 380mm diameter
- Film annealing with heater up to 550°C
- Surface cleaning and activation by etching
- Easy integration into fab automation
- Total down time for target and shield change max. 60min
Choose from large area single DC, DC Reactive or RF sputter with cooling, etch and RTP capabilities up to 550°C, Evatec multisource capability for up to 4 sputter cathodes at a single process module or custom sources for deposition of materials like Parylene.
All process modules run independently in isolation and are configured according to your application.
-
Dielectrics: SiN-H, SiN, SiO2, Al2O3, SiC
-
Metal Oxides: NbO2, TiO2, Ta2O5
-
TCOs: ITO, GZO, Zn: AlO
-
Metal stacks: Al, NiV, Ag, AuGe
-
Alloys with MSQ multisource
-
Deposition uniformities <±2% over whole carrier
-
Parylene coatings - C, N and F with superior uniformities and reduced dimer usage
Additional custom source technologies like Evatec's "Penta Plus" cathodes deliver precise step coverage solutions in applications like EMI shielding.
For more information about SOLARIS® capabilities download the brochure, take a look at some of the stories in Evatec's LAYERS magazine or contact your local sales and service organization.