Benefit from the CLUSTERLINE® reputation of secure handling and precision processing on a range of platform sizes up to 650mm in applications across all Evatec core markets.
Find out moreRead more about Evatecs new module for Plasma-Enhanced Atomic Layer Deposition (PEALD) in Layers 8.
Find out moreFind out how Evatec’s HEXAGON could double your throughput in selected power device applications.
Find out moreFrom thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the deposition of soft magnetics for integrated voltage regulators on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.
Find out moreLarge area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.
Find out moreBenefit from Evatec's long experience in Power Device applications to increase your productivity, process stability and yield in volume production of MOSFETs, IGBTs, IGCTs, LDMOS, SiC and GaN Power Devices.
Find out moreEvatec supports production solutions for the metals, dielectrics and Advanced Functional Materials (Magnetics and Piezoelectrics) used in Sensors, Actuators, TFH and Quantum Computing.
Find out moreEvatec thin film technology supports the economical manufacture of highly accurate optical components ensuring optimal performance in systems that rely on precise light manipulation.
Find out moreElevate your product performance with Evatec high-end Functional Coatings solutions, - high perfomance and high volume at the lowest cost of ownership.
Find out moreFrom thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.
Find out moreWLO uses semiconductor techniques to mass-produce mini optical components. Evatec enables cost-efficient production for use as standalone parts or on pre-processed dies.
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