Search results for "CLUSTERLINE® 系列"

1.

CLUSTERLINE® Family

Benefit from the CLUSTERLINE® reputation of secure handling and precision processing on a range of platform sizes up to 650mm in applications across all Evatec core markets. 

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2.

CLUSTERLINE® 300

From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the deposition of soft magnetics for integrated voltage regulators on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.

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3.

CLUSTERLINE® 600

Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.

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4.

CLUSTERLINE® 200

From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.

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