Wireless Communication
Thin film production platforms and processes for wireless technologies
From the latest high performance RF switches to the broader development of the 5G wireless devices our evaporation and sputter platforms support a portfolio of thin film processes for wireless communication applications. We deliver sputter processes and platforms for the gap filling and planarization required for temperature compensation of IDT structures. Our evaporation process specialists offer platforms and processes for "lift off" metallization in HBT and p-HEMT manufacturing, while our piezoelectric specialists offer sputter deposition of high performance piezoelectrics like AlScN for RF filter technology.
Our tools and processes ensure best in class thickness and stress uniformities for high production yields on wafer sizes up to 200mm.
You can read more about our thin film production solutions for Wireless applications in LAYERS
THE EVATEC TOOL PORTFOLIO FOR WIRELESS
Choose from the Evatec platforms according to your process requirements, throughput and factory integration requirements.
Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.
SAW and BAW
Our thin film processes using evaporation or sputter support the manufacture of existing and next generation low loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" or "Autoload" cassette-to-cassette handling whilst dedicated cathode technology on our
CLUSTERLINE® 200 platform enables the deposition of piezoelectric materials such as AlN and AlScN with a highest degree of crystal orientation and controlled stress for resonators, reflectors and electrodes.
Metallization Processes
Evatec evaporation platforms for contact and seed layers deliver reduced precious metals consumption using proprietary software like Unicalc. Systems with extended throw are optimized for "lift off" process geometries where subsequent film patterning steps call for zero side wall coverage.
Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.
From the latest high performance RF switches to the broader development of the 5G wireless devices our evaporation and sputter platforms support a portfolio of thin film processes for wireless communication applications. We deliver sputter processes and platforms for the gap filling and planarization required for temperature compensation of IDT structures. Our evaporation process specialists offer platforms and processes for "lift off" metallization in HBT and p-HEMT manufacturing, while our piezoelectric specialists offer sputter deposition of high performance piezoelectrics like AlScN for RF filter technology.
Our tools and processes ensure best in class thickness and stress uniformities for high production yields on wafer sizes up to 200mm.
You can read more about our thin film production solutions for Wireless applications in LAYERS
THE EVATEC TOOL PORTFOLIO FOR WIRELESS
Choose from the Evatec platforms according to your process requirements, throughput and factory integration requirements.
Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.
SAW and BAW
Our thin film processes using evaporation or sputter support the manufacture of existing and next generation low loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" or "Autoload" cassette-to-cassette handling whilst dedicated cathode technology on our
CLUSTERLINE® 200 platform enables the deposition of piezoelectric materials such as AlN and AlScN with a highest degree of crystal orientation and controlled stress for resonators, reflectors and electrodes.
Metallization Processes
Evatec evaporation platforms for contact and seed layers deliver reduced precious metals consumption using proprietary software like Unicalc. Systems with extended throw are optimized for "lift off" process geometries where subsequent film patterning steps call for zero side wall coverage.
Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.