New Video: Welcome to a world without compromises with CLUSTERLINE® 200
CLUSTERLINE® 200: Flexible Thin Film Processing Without Compromise
As device architectures become increasingly complex, manufacturers need production platforms that can evolve alongside changing process requirements. Flexibility, scalability and performance are critical for success across semiconductor, optoelectronic and photonic applications.
With more than 500 systems installed worldwide, CLUSTERLINE® 200 has established itself as a proven platform for manufacturing on 4", 6" and 8" substrates. Its flexible architecture integrates up to six process modules, allowing customers to configure the system according to their specific manufacturing needs.
The platform combines a broad portfolio of process technologies, including etch, DC and RF sputtering, advanced directional sputtering for 3D and high aspect ratio applications, co-sputter technologies for alloys and compounds, and Evatec's unique Facing Target Cathode technology. Multi-step process sequences can be completed without intermediate vacuum break, helping customers achieve demanding performance and repeatability targets.
CLUSTERLINE® 200 also supports advanced technology integration through low-temperature PECVD, PEALD for next-generation nanostructures, customized process chuck configurations and flexible vacuum transport solutions with integrated pre- and post-treatment options.
Watch the video to discover how CLUSTERLINE® 200 enables innovation across power devices, wireless applications, MEMS, silicon photonics and advanced packaging, while delivering the low cost of ownership and long-term adaptability manufacturers demand.
Learn more about CLUSTERLINE® 200 solutions on our website.