LAYERS 9 – Welcome to small panel processing
Evatec introduces a dedicated 310 × 310 mm panel‑level processing platform, addressing the growing demand for small panel formats in advanced packaging, particularly for AI and HPC applications.
Smaller panels offer better control of critical dimensions, improved overlay accuracy, and higher yields due to reduced warpage and mechanical stress compared to larger formats. Panel‑level packaging also delivers superior material utilization versus wafer‑level approaches, resulting in lower overall manufacturing costs.
The new CLUSTERLINE® 310 combines proven technologies from Evatec’s 12‑inch wafer systems and the CLUSTERLINE® 600 panel platform. Built on an established cluster architecture, it offers a compact footprint, optimized CAPEX, and fast time‑to‑market.
Supporting applications such as RDL seed deposition and backside metallization (BSM / TIM), the platform integrates Evatec’s degas pre‑treatment and Arctic Etch technologies to ensure high performance and reliability. Efficient gold source technology further reduces target investment.
With this launch, Evatec strengthens its position as a single‑source partner for wafer‑ and panel‑level advanced packaging solutions.
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