LAYERS 9 – 300mm Frontend Integration
As device scaling continues to push technological boundaries, the semiconductor industry is advancing along two powerful trajectories: “More Moore” for continued transistor scaling, and “More than Moore” for diverse functionality through advanced packaging. Meeting the demands of both paths requires deposition technologies that deliver exceptional precision, low contamination, and robust process stability.
Evatec’s CLUSTERLINE® 300 platform provides the foundation for these next‑generation requirements. Building on established planar frontend capabilities, Evatec has significantly expanded its process portfolio through extensive development in Standard Directional Sputtering (SDS) and Advanced Directional Sputtering (ADS). These technologies enable high‑quality deposition for complex device architectures, supporting critical dimensions below 110 nm and aspect ratios up to the limits of PVD technology.
The platform integrates hot/cold electrostatic chucks, advanced chamber configuration options, optical monitoring, and contamination‑controlled process modules. Together, these features ensure high uniformity, excellent material purity, and repeatable, mass‑production‑ready performance. Current qualified processes include Ti, TiN, Al alloys, Ta, TaN, Cu, and emerging materials such as Ruthenium. Productivity on fully equipped systems can reach up to 50 wafers per hour, making CLUSTERLINE® 300 a compelling solution for high‑volume manufacturing.
With SDS and ADS, manufacturers can achieve superior step coverage in trench and via structures, optimized reflectivity performance, and stable temperature‑resistant layers for advanced memory and logic applications. Beyond these capabilities, Evatec is already preparing for the next evolution in frontend processing by extending ALD and CVD technologies from the 200mm platform to the 300mm toolset, laying the groundwork for future high‑precision nanostructures below 35 nm.
These developments mark a major step forward in Evatec’s mission to support customers in reaching new performance levels across both semiconductor scaling strategies. With continuous innovation across hardware, process engineering, and metrology, Evatec is committed to enabling the technologies that will power the next generation of essential chips.
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