HEXAGON
You advantage in Advanced Packaging
Leadership in UBM, RDL and Fanout on 300mm
Panel Level Packaging
- Leadership in Degas, Etch and PVD technologies
- Best CoO in Fanout with low contact resistance (Rc)
Lowest Contact Resistance
- Lowest Rc (<2.0mOhm) without compromise on wafer throughput
- Unique handling enables up to 80 wafer per hours
Production proven
- Longest kit lives >20'000 wafers
- Lowest consumable costs