CLUSTERLINE® 600
Panel processing up to 650mm
From 300x300 to 650x650 – proven panel processing capability
Panel Level Packaging
- Portfolio of Degas, Etch and PVD technologies
- Reliable deposition of low contact resistance (Rc)
Advanced IC Substrates
- Emerging technologies including glass core
- Custom tool features including substrate flip
High Performance Computing and AI
- Backside metallization processes for thermal management
- Best substrate utilization efficiency for large package sizes