CLUSTERLINE® 300
Cluster architecture for 300mm
Secure 300mm wafer handling across Advanced Packaging, Power Devices and Wafer Level Optics
Wafer Level Packaging
- Superior management of contact resistance and layer uniformities for applications including WLCSP, FOPLP and 2.5/3D device synthesis
- Backside metallization processes for applications including Artificial Intelligence
Power Devices
- Front and backside processes with over 50 years production process know-how on Si
- Supporting Industry innovation with new processes e.g Cu for front side contact technology
Wafer Level Optics
- Low particles and precision for processes on high value wafers
- 300mm processes supporting growth of high volume consumer applications including Augmented Reality