CLUSTERLINE®

Cluster architecture 200mm, 300mm and 600mm formats

 

CLUSTERLINE® FAMILY

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CLN 200 New

CLUSTERLINE® 200

From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.

Evatec CLUSTERLINE 200BPM

CLUSTERLINE® 200 BPM

Part of the CLUSTERLINE® Family, the BPM is a cassette-to-cassette dynamic batch sputter tool offering high throughput and precision in MEMS, Wireless, Optoelectronics, and Photonics applications. Choose the BPM for the best uniformities and the lowest particle levels in high volume applications.

CLN 300 New

CLUSTERLINE® 300

From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the depoistion of soft magnetics for integrated voltage regulations on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities. 

EVATEC_CLUSTERLINE600_PANEL

CLUSTERLINE® 600

Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.

CLUSTERLINE® Family Brochure

CLUSTERLINE® Family Video

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