From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.

Part of the CLUSTERLINE® Family, the BPM is a cassette-to-cassette dynamic batch sputter tool offering high throughput and precision in MEMS, Wireless, Optoelectronics, and Photonics applications. Choose the BPM for the best uniformities and the lowest particle levels in high volume applications.

From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the depoistion of soft magnetics for integrated voltage regulations on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities. 

Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.