New Video: Our new dedicated small panel packaging solution is here
Panel Level Packaging: High Uniformity PVD Solutions on small panels for “Next Generation” Applications
Panel Level Packaging continues to gain momentum as the semiconductor industry seeks cost-effective approaches to Advanced Packaging for larger chiplet sizes. There is a new smaller panel format emerging for certain applications within areas like AI/HPC, and automotive.
Evatec’s existing expertise in Physical Vapor Deposition (PVD) solutions for advanced packaging, combined with our know-how from delivering solutions for both wafer and “large” panel formats up to 650mm is the perfect foundation for addressing the new market requirements. High uniformity etch and deposition processes with effective management of substrate bow, stress and particles comes as standard.
Watch the video and find out how Evatec has leveraged its existing know-how to fast-track market launch of its new CLUSTERLINE® 310 solution for panels up to 321x310mm.
Learn more about PLP solutions on our website.