SAL collaboration on PEALD technology brings next generation Radio Frequency Front End (RFFE) components one step closer

The three-way cooperation over the next 4 years under SAL’s CHIP2SYS program will focus on the development of both deposition and annealing processes for the AlN and InGaN seed layers required prior to deposition of AlScN piezoelectric layers and leverages the unique capability of PEALD for depositing high-quality layers with atomic precision. SAL will lead the overall project including deposition of the thin film layers using PEALD and PVD at its existing R&D facility in Villach. Evatec will support the project through hardware development whilst RF360 will benchmark any processes and assess suitability for mass production.

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