Evatec delivers first CLUSTERLINE® 310
Evatec has delivered its first dedicated CLUSTERLINE® 310 for panel level packaging on 310×310mm panel formats to a leading global IDM. The tool will be used to support their next generation chip manufacturing and integrates degas, etch and PVD technologies for processing of glass and highly outgassing organics. This delivery marks the beginning of a robust pipeline of global customer orders, with further deliveries scheduled over the coming months.
Evatec Business Field Manager Admir Asanoski commented: “As the market leader in delivering packaging solutions for larger panels up to 650mm around the globe over the last 8 years, our team has gained a deep understanding of the challenges of panel processing and the cost benefits of manufacturing on larger package sizes in areas like HPC and AI."
Get a first look at the CLUSTERLINE® 310 in our teaser video