C2MI has signed an agreement to take delivery of two Evatec CLUSTERLINE® 300 thin film cluster tools for its Bromont facility in Canada. The machines will be configured with proprietary PVD deposition, etch, and degas technologies to support advanced 3DHI processes used in MEMS and Advanced Packaging manufacturing. The CLUSTERLINE® 300 platform offers flexibility to simultaneously process 200mm and 300mm substrate formats without the need for a kit change or hardware change. Additional unique capabilities include HIPIMS for high aspect ratio TSV seeding, arctic etch for high volume UBM/RDL process control, and atmospheric batch degas (ABD) to efficiently process highly organic substrates commonly used in today’s FOWLP technology.
C2MI CEO, Marie-Josée Turgeon commented “The collaboration with Evatec is instrumental in expanding our capabilities, enabling us to develop, integrate, and validate advanced thin film processes for MEMS and advanced packaging in a collaborative R&D environment. They will allow us to rapidly prototype and de-risk innovations, ranging from high aspect ratio TSV and RDL to complex heterogeneous integration schemes, on both 200mm and 300mm platforms. This investment directly supports our mission to accelerate the commercialization of next-generation technologies, by bridging the gap between research and scalable manufacturing.”
Evatec North America Managing Director Helfried Weinzerl commented "We are proud to support C2MI and its local industrial partners with advanced R&D and pilot-line manufacturing capabilities that are designed for rapid scalability into high-volume production. This collaboration reflects a strong strategic alignment, built on our expertise and long-term commitment to MEMS and Advanced Packaging technologies. Beyond this, we see significant potential to further expand our partnership into emerging fields such as Quantum technologies and Silicon Photonics, key innovation areas where Evatec is making substantial investments today."