LAYERS 9 – Keeping Cool with the Hottest Technology
High volume production of crystalline films has long been a challenge. While molecular beam epitaxy (MBE) delivers excellent film quality, its low deposition rates limit scalability. Evatec’s latest developments in hot chuck and Facing Target Cathode (FTC) technology now open the door to epitaxial and quasi epitaxial growth using PVD based processes on the proven CLUSTERLINE® 300 platform.
These innovations support a wide range of advanced functional materials including Barium Titanate (BTO), Gallium Nitride (GaN), Indium Tin Oxide (ITO), and Lithium Niobate (LNO). By combining elevated substrate temperatures with low damage deposition techniques, Evatec delivers practical production solutions that meet stringent requirements for film uniformity, throughput, and contamination control.
- Very Hot Chuck Technology: Heats 12" wafers up to 750 °C with ±2% uniformity, enabling crystalline growth while rotating during deposition for dynamic averaging.
- Facing Target Cathode (FTC): Independently controlled sources optimized through plasma simulations ensure high deposition rates and thickness uniformity, while minimizing particle generation.
- Advanced Cooling & Shielding: Thermal shielding, active and passive cooling, and temperature resistant materials ensure reliable operation under ultra high vacuum conditions.
Extensive simulations and component testing on 200 mm and 300 mm wafers validate the approach. The 300 mm hardware will be available for customer sampling at the Evatec Competence Laboratory (ECL) in Q2 2026, marking a major milestone in bringing PVD epitaxy into mainstream production.
Read the full article here
Why not then order your copy of the full magazine as pdf or hardcopy? Simply write an e-mail to communications@evatecnet.com. Don't forget to include your chosen delivery address.