LAYERS 9 – Advancing SiC Power Device Manufacturing
Silicon carbide (SiC) is rapidly becoming the material of choice for high‑voltage and high‑temperature power electronics, especially in demanding automotive and aerospace environments. However, the fabrication of SiC power devices poses a well‑known challenge: high‑temperature annealing above 1600°C leads to carbon out‑diffusion, severe surface roughening, and reliability issues at the MOS interface. Traditionally, carbon layers formed from photoresist have been used to protect the SiC surface during annealing, but this approach introduces significant limitations for mass production, including particle contamination and process inconsistency.
Evatec’s latest development in amorphous‑carbon (a‑C) sputtering provides an innovative and robust alternative. Using the CLUSTERLINE® 200 platform, the company demonstrates high‑quality a‑C deposition with excellent uniformity and repeatability. The sputtered layers—tested across thicknesses from 20 nm to 280 nm—deliver reliable protection during annealing cycles up to 2000°C. Notably, layers of 50 nm thickness showed performance comparable to photoresist‑derived carbon while offering a much cleaner, production‑friendly process.
Surface roughness analysis using AFM confirmed that thicker sputtered layers significantly reduce surface degradation at elevated temperatures. At 1900°C, even 20 nm layers maintained effective protection, with 50 nm layers offering enhanced stability—an essential advantage for advanced applications such as trench structures and superjunction devices.
Beyond protection, Evatec’s research also highlights the remarkable influence of a‑C layers on dopant implantation profiles. When used as a pre‑implant screening layer, a 50 nm coating effectively minimized carrier concentration spikes, enabling more controlled dopant distribution and improved downstream device performance. This additional benefit opens new possibilities for process tuning and next‑generation SiC device design.
Evatec’s amorphous‑carbon sputtering solution marks a significant advancement for manufacturers seeking cleaner, more reliable, and more flexible SiC processing technologies.
Why not then order your copy of the full magazine as pdf or hardcopy? Simply write an e-mail to communications@evatecnet.com. Don't forget to include your chosen delivery address.