9th December 2024

LAYERS 8 – PCB / IC-Substrate – Reducing the environmental impact

AT&S experts Gernot Schulz and Christof Wernbacher, together with Evatec's Senior Product Marketing Manager Roland Rettenmeier, explain how the CO2 footprint of PCB manufacturing can be reduced by reducing raw materials and wet processes, optimizing product build ups and introducing dry processes.


The Electronics industry as well as the PCB industry are undergoing a massive change in manufacturing. Governments, OEMs and customers all require a reduction of the CO₂ footprint and a resource-efficient use of raw materials, support materials, energy and water throughout the entire value/supply chain.


Read the article here


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