LAYERS 8 – HEXAGON – Optimum Rc Control & Productivity
The megatrend of more miniaturized electronic devices highlights the importance of low and stable contact resistance (Rc). To classify the capability of Evatec’s HEXAGON as High-Throughput UBM/RDL Technology, we report the details of experimental work on throughput and Rc previously presented and published at ECTC by Evatec’s Team and Fraunhofer IZM-ASSID.
Digital transformation has significantly increased data processing volumes, driving the demand for higher performance devices and miniaturization. Wafer-level packaging (WLP) and wafer level chip-scale packaging (WLCSP) are essential in meeting these demands, requiring advanced designs with vertical interconnects and redistribution layer (RDL) technologies below 5 µm. Controlling low Rc is crucial for maintaining electrical performance in these solutions.
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