13th January 2025
LAYERS 8 – Frontside Processes – Trench/Via filling & Planarization
Trends in frontside contact formation in new power device technologies on Si or SiC are calling for ever more demanding thin film processes – trenches get deeper, aspect ratios get higher and expectations for the quality of the final planarized surface grow. Evatec’s Product Marketing Manager Fabian Kramer and Manager of Technology Development Mohamed Elghazzali give us a taste of the Evatec solutions supporting customers in 2025 and beyond.
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