THE SKY’S THE LIMIT WITH CLUSTERLINE® 300

As we strive for increased performance and functionality of chips, back-end-of-line (BEOL) of the front-end is starting to converge with advanced packaging. Evatec’s Kai Wenz, Senior Manager Development Projects for BU Semiconductor explains the thinking behind the release of a new front-end sputtering module on the latest variant of CLUSTERLINE® 300. Together with new platform pre-treatment features through different degassing and clean etch options, the source features include hot electrostatic clamping with active backside gas conduction heating up to 450°C, advanced power modulation and new shield design to meet particle and contamination requirements of CMOS front-end technology.

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