LAYERS 6 - 300MM BACKSIDE METALLIZATION PROCESSES

Improved Process Control & Productivity                  

The latest customer demands on productivity and performance require the tailoring of process configurations depending on individual application needs. The versatile CLUSTERLINE® 300 PVD system for backside metallization provides dedicated configurations to optimize process results and cost of ownership. Temperature control through effective wafer cooling during deposition is a key element for this optimization. Evatec’s Gerald Feistritzer compares the latest recessed chuck solution with electrostatic chuck (ESC) technology and demonstrates the benefits of a dedicated processing solution for thin wafers and TAIKO wafers.

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